JPS5080764A - - Google Patents
Info
- Publication number
- JPS5080764A JPS5080764A JP48127260A JP12726073A JPS5080764A JP S5080764 A JPS5080764 A JP S5080764A JP 48127260 A JP48127260 A JP 48127260A JP 12726073 A JP12726073 A JP 12726073A JP S5080764 A JPS5080764 A JP S5080764A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48127260A JPS5080764A (ja) | 1973-11-14 | 1973-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48127260A JPS5080764A (ja) | 1973-11-14 | 1973-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5080764A true JPS5080764A (ja) | 1975-07-01 |
Family
ID=14955628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48127260A Pending JPS5080764A (ja) | 1973-11-14 | 1973-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5080764A (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020053611A (ja) * | 2018-09-28 | 2020-04-02 | 三菱電機株式会社 | 半導体モジュール、および、半導体モジュールの製造方法 |
-
1973
- 1973-11-14 JP JP48127260A patent/JPS5080764A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020053611A (ja) * | 2018-09-28 | 2020-04-02 | 三菱電機株式会社 | 半導体モジュール、および、半導体モジュールの製造方法 |