JPS5079264A - - Google Patents

Info

Publication number
JPS5079264A
JPS5079264A JP48126284A JP12628473A JPS5079264A JP S5079264 A JPS5079264 A JP S5079264A JP 48126284 A JP48126284 A JP 48126284A JP 12628473 A JP12628473 A JP 12628473A JP S5079264 A JPS5079264 A JP S5079264A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48126284A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48126284A priority Critical patent/JPS5079264A/ja
Publication of JPS5079264A publication Critical patent/JPS5079264A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP48126284A 1973-11-12 1973-11-12 Pending JPS5079264A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48126284A JPS5079264A (ja) 1973-11-12 1973-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48126284A JPS5079264A (ja) 1973-11-12 1973-11-12

Publications (1)

Publication Number Publication Date
JPS5079264A true JPS5079264A (ja) 1975-06-27

Family

ID=14931394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48126284A Pending JPS5079264A (ja) 1973-11-12 1973-11-12

Country Status (1)

Country Link
JP (1) JPS5079264A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326670A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Manufacture of semiconductor device
JPH01266726A (ja) * 1988-04-18 1989-10-24 Sanyo Electric Co Ltd 半導体装置の組立装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831385A (ja) * 1971-08-30 1973-04-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831385A (ja) * 1971-08-30 1973-04-24

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326670A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Manufacture of semiconductor device
JPH01266726A (ja) * 1988-04-18 1989-10-24 Sanyo Electric Co Ltd 半導体装置の組立装置

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