JPS507912A - - Google Patents
Info
- Publication number
- JPS507912A JPS507912A JP6042573A JP6042573A JPS507912A JP S507912 A JPS507912 A JP S507912A JP 6042573 A JP6042573 A JP 6042573A JP 6042573 A JP6042573 A JP 6042573A JP S507912 A JPS507912 A JP S507912A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6042573A JPS507912A (zh) | 1973-05-30 | 1973-05-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6042573A JPS507912A (zh) | 1973-05-30 | 1973-05-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS507912A true JPS507912A (zh) | 1975-01-27 |
Family
ID=13141835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6042573A Pending JPS507912A (zh) | 1973-05-30 | 1973-05-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS507912A (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53108763A (en) * | 1977-02-28 | 1978-09-21 | Siltec Corp | Device for polishing semiconductor wafer |
JPS5415672A (en) * | 1977-07-06 | 1979-02-05 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
JPS5441068A (en) * | 1977-09-08 | 1979-03-31 | Nec Home Electronics Ltd | Production of semiconductor devices |
JPS58121644A (ja) * | 1982-01-12 | 1983-07-20 | Mitsubishi Electric Corp | 半導体ウエ−ハの厚さの調整方法 |
JPS6084822A (ja) * | 1983-10-15 | 1985-05-14 | Rohm Co Ltd | 半導体装置の製造方法 |
JPS62203364A (ja) * | 1986-03-03 | 1987-09-08 | Nec Corp | 半導体装置の製造方法 |
US5945349A (en) * | 1995-07-19 | 1999-08-31 | Hyundai Electronics Industries Co., Ltd. | Method of enabling analysis of defects of semiconductor device with three dimensions |
-
1973
- 1973-05-30 JP JP6042573A patent/JPS507912A/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53108763A (en) * | 1977-02-28 | 1978-09-21 | Siltec Corp | Device for polishing semiconductor wafer |
JPS5833699B2 (ja) * | 1977-02-28 | 1983-07-21 | スイルテク・コ−ポレ−シヨン | 半導体ウエ−フア−用の研磨装置 |
JPS5415672A (en) * | 1977-07-06 | 1979-02-05 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
JPS5441068A (en) * | 1977-09-08 | 1979-03-31 | Nec Home Electronics Ltd | Production of semiconductor devices |
JPS58121644A (ja) * | 1982-01-12 | 1983-07-20 | Mitsubishi Electric Corp | 半導体ウエ−ハの厚さの調整方法 |
JPS6084822A (ja) * | 1983-10-15 | 1985-05-14 | Rohm Co Ltd | 半導体装置の製造方法 |
JPS62203364A (ja) * | 1986-03-03 | 1987-09-08 | Nec Corp | 半導体装置の製造方法 |
US5945349A (en) * | 1995-07-19 | 1999-08-31 | Hyundai Electronics Industries Co., Ltd. | Method of enabling analysis of defects of semiconductor device with three dimensions |