JPS50753A - - Google Patents

Info

Publication number
JPS50753A
JPS50753A JP48048527A JP4852773A JPS50753A JP S50753 A JPS50753 A JP S50753A JP 48048527 A JP48048527 A JP 48048527A JP 4852773 A JP4852773 A JP 4852773A JP S50753 A JPS50753 A JP S50753A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48048527A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48048527A priority Critical patent/JPS50753A/ja
Publication of JPS50753A publication Critical patent/JPS50753A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8336—Bonding interfaces of the semiconductor or solid state body
    • H01L2224/83365—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP48048527A 1973-05-02 1973-05-02 Pending JPS50753A (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48048527A JPS50753A (enrdf_load_stackoverflow) 1973-05-02 1973-05-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48048527A JPS50753A (enrdf_load_stackoverflow) 1973-05-02 1973-05-02

Publications (1)

Publication Number Publication Date
JPS50753A true JPS50753A (enrdf_load_stackoverflow) 1975-01-07

Family

ID=12805818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48048527A Pending JPS50753A (enrdf_load_stackoverflow) 1973-05-02 1973-05-02

Country Status (1)

Country Link
JP (1) JPS50753A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2755028A1 (de) * 1976-12-09 1978-06-22 Rhone Poulenc Ind Verfahren zur herstellung von hohlkoerpern und nach dem verfahren hergestellter hohlkoerper
JPS54146169U (enrdf_load_stackoverflow) * 1978-03-31 1979-10-11
JPS55130135A (en) * 1979-03-30 1980-10-08 Fujitsu Ltd Semiconductor device
JPS56134750A (en) * 1980-03-25 1981-10-21 Fujitsu Ltd Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2755028A1 (de) * 1976-12-09 1978-06-22 Rhone Poulenc Ind Verfahren zur herstellung von hohlkoerpern und nach dem verfahren hergestellter hohlkoerper
DE2755028C3 (de) * 1976-12-09 1984-04-05 Rhône-Poulenc Industries, 75008 Paris Verfahren zum Herstellen eines Rohres oder eines Hohlkörpers aus thermoplastischem, zumindest teilkristallinem Material
JPS54146169U (enrdf_load_stackoverflow) * 1978-03-31 1979-10-11
JPS55130135A (en) * 1979-03-30 1980-10-08 Fujitsu Ltd Semiconductor device
JPS56134750A (en) * 1980-03-25 1981-10-21 Fujitsu Ltd Semiconductor device

Similar Documents

Publication Publication Date Title
AU476761B2 (enrdf_load_stackoverflow)
AU465372B2 (enrdf_load_stackoverflow)
AU465453B2 (enrdf_load_stackoverflow)
AU471343B2 (enrdf_load_stackoverflow)
AU465434B2 (enrdf_load_stackoverflow)
AU450229B2 (enrdf_load_stackoverflow)
AU476714B2 (enrdf_load_stackoverflow)
AU472848B2 (enrdf_load_stackoverflow)
AR199451A1 (enrdf_load_stackoverflow)
AU466283B2 (enrdf_load_stackoverflow)
JPS50753A (enrdf_load_stackoverflow)
JPS49123583A (enrdf_load_stackoverflow)
AU477823B2 (enrdf_load_stackoverflow)
AU471461B2 (enrdf_load_stackoverflow)
AU476873B1 (enrdf_load_stackoverflow)
AU447540B2 (enrdf_load_stackoverflow)
AR200256A1 (enrdf_load_stackoverflow)
AU477824B2 (enrdf_load_stackoverflow)
AU461342B2 (enrdf_load_stackoverflow)
AR195948A1 (enrdf_load_stackoverflow)
AU1891376A (enrdf_load_stackoverflow)
AU479419A (enrdf_load_stackoverflow)
BG19731A1 (enrdf_load_stackoverflow)
AU479404A (enrdf_load_stackoverflow)
AU479405A (enrdf_load_stackoverflow)