JPS5075208A - - Google Patents

Info

Publication number
JPS5075208A
JPS5075208A JP12435773A JP12435773A JPS5075208A JP S5075208 A JPS5075208 A JP S5075208A JP 12435773 A JP12435773 A JP 12435773A JP 12435773 A JP12435773 A JP 12435773A JP S5075208 A JPS5075208 A JP S5075208A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12435773A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12435773A priority Critical patent/JPS5075208A/ja
Publication of JPS5075208A publication Critical patent/JPS5075208A/ja
Pending legal-status Critical Current

Links

JP12435773A 1973-11-07 1973-11-07 Pending JPS5075208A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12435773A JPS5075208A (en) 1973-11-07 1973-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12435773A JPS5075208A (en) 1973-11-07 1973-11-07

Publications (1)

Publication Number Publication Date
JPS5075208A true JPS5075208A (en) 1975-06-20

Family

ID=14883380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12435773A Pending JPS5075208A (en) 1973-11-07 1973-11-07

Country Status (1)

Country Link
JP (1) JPS5075208A (en)

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5899183A (en) * 1981-12-09 1983-06-13 株式会社日立製作所 Non-oxide ceramic body with thick film circuit
JPS593077A (en) * 1982-06-29 1984-01-09 株式会社東芝 Method of bonding ceramic member and metal
JPS5940404A (en) * 1982-08-30 1984-03-06 株式会社東芝 Thermal conductive substrate
JPS59121175A (en) * 1982-12-28 1984-07-13 株式会社東芝 Manufacture of heat radiator
JPS59121860A (en) * 1982-12-28 1984-07-14 Toshiba Corp Substrate for semiconductor
JPS59190279A (en) * 1983-04-13 1984-10-29 株式会社東芝 Ceramic structure and manufacture
JPS59203783A (en) * 1983-04-28 1984-11-17 株式会社東芝 Metallization of non-oxide ceramic sintered body
JPS60178647A (en) * 1984-02-27 1985-09-12 Toshiba Corp Semiconductor device
JPS60178688A (en) * 1984-02-27 1985-09-12 株式会社東芝 High thermal conductivity circuit board
JPS6184089A (en) * 1984-10-01 1986-04-28 株式会社東芝 High heat conductive circuit board
JPS61119094A (en) * 1984-11-15 1986-06-06 株式会社東芝 High thermoconductive circuit board
JPS61132580A (en) * 1984-11-30 1986-06-20 京セラ株式会社 Metallization of nitride ceramic body
JPS61168938A (en) * 1985-01-22 1986-07-30 Toshiba Corp Ceramic package and manufacture thereof
JPS6246986A (en) * 1985-08-22 1987-02-28 住友電気工業株式会社 Aluminum nitride substrate and its manufacturing method
JPS6257239A (en) * 1985-09-06 1987-03-12 Hitachi Ltd Aluminum nitride substrate for mounting semiconductor devices and its manufacturing method
JPS62197376A (en) * 1986-02-20 1987-09-01 株式会社東芝 Aluminum nitride substrate
JPS62197377A (en) * 1986-02-20 1987-09-01 株式会社東芝 Substrate for ignitor
JPS62197378A (en) * 1986-02-20 1987-09-01 株式会社東芝 Insulative substance for high frequency transistor
JPS62207789A (en) * 1986-03-08 1987-09-12 日本特殊陶業株式会社 Surface structure for aluminum nitride material and manufacture
JPS62226879A (en) * 1986-03-27 1987-10-05 株式会社東芝 Aluminum nitride sintered body with sealed portion
JPS6351662A (en) * 1986-08-21 1988-03-04 Toshiba Corp Aluminum nitride substrate and manufacture thereof
JPS63115393A (en) * 1986-11-01 1988-05-19 株式会社住友金属セラミックス High heat-conductivity circuit board
JPS6490586A (en) * 1987-10-01 1989-04-07 Ngk Insulators Ltd Aluminum nitride component and manufacture thereof
US5529852A (en) * 1987-01-26 1996-06-25 Sumitomo Electric Industries, Ltd. Aluminum nitride sintered body having a metallized coating layer on its surface
US5637406A (en) * 1989-03-31 1997-06-10 Kabushiki Kaisha Toshiba Metallized aluminum nitride substrate
JP2004162147A (en) * 2002-11-15 2004-06-10 Plasma Giken Kogyo Kk Aluminum nitride sintered body having thermal-sprayed coating
JP2009143766A (en) * 2007-12-14 2009-07-02 Tokuyama Corp Metallized substrate and manufacturing method thereof
KR20180084529A (en) 2017-01-17 2018-07-25 주식회사 케이씨씨 Ceramic circuit board and method of manufacturing the same

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5899183A (en) * 1981-12-09 1983-06-13 株式会社日立製作所 Non-oxide ceramic body with thick film circuit
JPS593077A (en) * 1982-06-29 1984-01-09 株式会社東芝 Method of bonding ceramic member and metal
JPS5940404A (en) * 1982-08-30 1984-03-06 株式会社東芝 Thermal conductive substrate
JPS59121175A (en) * 1982-12-28 1984-07-13 株式会社東芝 Manufacture of heat radiator
JPS59121860A (en) * 1982-12-28 1984-07-14 Toshiba Corp Substrate for semiconductor
JPS59190279A (en) * 1983-04-13 1984-10-29 株式会社東芝 Ceramic structure and manufacture
JPS59203783A (en) * 1983-04-28 1984-11-17 株式会社東芝 Metallization of non-oxide ceramic sintered body
JPS60178647A (en) * 1984-02-27 1985-09-12 Toshiba Corp Semiconductor device
JPS60178688A (en) * 1984-02-27 1985-09-12 株式会社東芝 High thermal conductivity circuit board
JPS6184089A (en) * 1984-10-01 1986-04-28 株式会社東芝 High heat conductive circuit board
JPS61119094A (en) * 1984-11-15 1986-06-06 株式会社東芝 High thermoconductive circuit board
JPS61132580A (en) * 1984-11-30 1986-06-20 京セラ株式会社 Metallization of nitride ceramic body
JPS61168938A (en) * 1985-01-22 1986-07-30 Toshiba Corp Ceramic package and manufacture thereof
JPS6246986A (en) * 1985-08-22 1987-02-28 住友電気工業株式会社 Aluminum nitride substrate and its manufacturing method
JPS6257239A (en) * 1985-09-06 1987-03-12 Hitachi Ltd Aluminum nitride substrate for mounting semiconductor devices and its manufacturing method
JPS62197376A (en) * 1986-02-20 1987-09-01 株式会社東芝 Aluminum nitride substrate
JPS62197377A (en) * 1986-02-20 1987-09-01 株式会社東芝 Substrate for ignitor
JPS62197378A (en) * 1986-02-20 1987-09-01 株式会社東芝 Insulative substance for high frequency transistor
JPS62207789A (en) * 1986-03-08 1987-09-12 日本特殊陶業株式会社 Surface structure for aluminum nitride material and manufacture
JPS62226879A (en) * 1986-03-27 1987-10-05 株式会社東芝 Aluminum nitride sintered body with sealed portion
JPS6351662A (en) * 1986-08-21 1988-03-04 Toshiba Corp Aluminum nitride substrate and manufacture thereof
JPS63115393A (en) * 1986-11-01 1988-05-19 株式会社住友金属セラミックス High heat-conductivity circuit board
US5529852A (en) * 1987-01-26 1996-06-25 Sumitomo Electric Industries, Ltd. Aluminum nitride sintered body having a metallized coating layer on its surface
JPS6490586A (en) * 1987-10-01 1989-04-07 Ngk Insulators Ltd Aluminum nitride component and manufacture thereof
US5637406A (en) * 1989-03-31 1997-06-10 Kabushiki Kaisha Toshiba Metallized aluminum nitride substrate
JP2004162147A (en) * 2002-11-15 2004-06-10 Plasma Giken Kogyo Kk Aluminum nitride sintered body having thermal-sprayed coating
JP2009143766A (en) * 2007-12-14 2009-07-02 Tokuyama Corp Metallized substrate and manufacturing method thereof
KR20180084529A (en) 2017-01-17 2018-07-25 주식회사 케이씨씨 Ceramic circuit board and method of manufacturing the same

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