JPS5075208A - - Google Patents
Info
- Publication number
- JPS5075208A JPS5075208A JP12435773A JP12435773A JPS5075208A JP S5075208 A JPS5075208 A JP S5075208A JP 12435773 A JP12435773 A JP 12435773A JP 12435773 A JP12435773 A JP 12435773A JP S5075208 A JPS5075208 A JP S5075208A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12435773A JPS5075208A (en) | 1973-11-07 | 1973-11-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12435773A JPS5075208A (en) | 1973-11-07 | 1973-11-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5075208A true JPS5075208A (en) | 1975-06-20 |
Family
ID=14883380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12435773A Pending JPS5075208A (en) | 1973-11-07 | 1973-11-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5075208A (en) |
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5899183A (en) * | 1981-12-09 | 1983-06-13 | 株式会社日立製作所 | Non-oxide ceramic body having thick film circuit |
JPS593077A (en) * | 1982-06-29 | 1984-01-09 | 株式会社東芝 | Method of bonding ceramic member and metal |
JPS5940404A (en) * | 1982-08-30 | 1984-03-06 | 株式会社東芝 | Thermal conductive substrate |
JPS59121175A (en) * | 1982-12-28 | 1984-07-13 | 株式会社東芝 | Manufacture of heat radiator |
JPS59121860A (en) * | 1982-12-28 | 1984-07-14 | Toshiba Corp | Substrate for semiconductor |
JPS59190279A (en) * | 1983-04-13 | 1984-10-29 | 株式会社東芝 | Ceramic structure and manufacture |
JPS59203783A (en) * | 1983-04-28 | 1984-11-17 | 株式会社東芝 | Metallization of non-oxide ceramic sintered body |
JPS60178647A (en) * | 1984-02-27 | 1985-09-12 | Toshiba Corp | Semiconductor device |
JPS60178688A (en) * | 1984-02-27 | 1985-09-12 | 株式会社東芝 | High thermal conductivity circuit board |
JPS6184089A (en) * | 1984-10-01 | 1986-04-28 | 株式会社東芝 | High heat conductive circuit board |
JPS61119094A (en) * | 1984-11-15 | 1986-06-06 | 株式会社東芝 | High thermoconductive circuit board |
JPS61132580A (en) * | 1984-11-30 | 1986-06-20 | 京セラ株式会社 | Metallization of nitride ceramic body |
JPS61168938A (en) * | 1985-01-22 | 1986-07-30 | Toshiba Corp | Ceramic package and manufacture thereof |
JPS6246986A (en) * | 1985-08-22 | 1987-02-28 | 住友電気工業株式会社 | Aluminum nitride substrate and manufacture |
JPS6257239A (en) * | 1985-09-06 | 1987-03-12 | Hitachi Ltd | Aluminum nitride substrate for mounting semiconductor device and manufacture thereof |
JPS62197378A (en) * | 1986-02-20 | 1987-09-01 | 株式会社東芝 | Insulative substance for high frequency transistor |
JPS62197377A (en) * | 1986-02-20 | 1987-09-01 | 株式会社東芝 | Substrate for ignitor |
JPS62197376A (en) * | 1986-02-20 | 1987-09-01 | 株式会社東芝 | Aluminum nitride substrate |
JPS62207789A (en) * | 1986-03-08 | 1987-09-12 | 日本特殊陶業株式会社 | Surface structure for aluminum nitride material and manufacture |
JPS62226879A (en) * | 1986-03-27 | 1987-10-05 | 株式会社東芝 | Aluminum nitride sintered body with sealed portion |
JPS6351662A (en) * | 1986-08-21 | 1988-03-04 | Toshiba Corp | Aluminum nitride substrate and manufacture thereof |
JPS63115393A (en) * | 1986-11-01 | 1988-05-19 | 株式会社住友金属セラミックス | High heat-conductivity circuit board |
JPS6490586A (en) * | 1987-10-01 | 1989-04-07 | Ngk Insulators Ltd | Aluminum nitride component and manufacture thereof |
US5529852A (en) * | 1987-01-26 | 1996-06-25 | Sumitomo Electric Industries, Ltd. | Aluminum nitride sintered body having a metallized coating layer on its surface |
US5637406A (en) * | 1989-03-31 | 1997-06-10 | Kabushiki Kaisha Toshiba | Metallized aluminum nitride substrate |
JP2004162147A (en) * | 2002-11-15 | 2004-06-10 | Plasma Giken Kogyo Kk | Aluminum nitride sintered body having thermal-sprayed coating |
JP2009143766A (en) * | 2007-12-14 | 2009-07-02 | Tokuyama Corp | Metallized substrate, and method of manufacturing the same |
KR20180084529A (en) | 2017-01-17 | 2018-07-25 | 주식회사 케이씨씨 | Ceramic circuit board and method of manufacturing the same |
-
1973
- 1973-11-07 JP JP12435773A patent/JPS5075208A/ja active Pending
Cited By (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5899183A (en) * | 1981-12-09 | 1983-06-13 | 株式会社日立製作所 | Non-oxide ceramic body having thick film circuit |
JPS593077A (en) * | 1982-06-29 | 1984-01-09 | 株式会社東芝 | Method of bonding ceramic member and metal |
JPH0424312B2 (en) * | 1982-06-29 | 1992-04-24 | Tokyo Shibaura Electric Co | |
JPS5940404A (en) * | 1982-08-30 | 1984-03-06 | 株式会社東芝 | Thermal conductive substrate |
JPH0328825B2 (en) * | 1982-08-30 | 1991-04-22 | Tokyo Shibaura Electric Co | |
JPS59121175A (en) * | 1982-12-28 | 1984-07-13 | 株式会社東芝 | Manufacture of heat radiator |
JPS59121860A (en) * | 1982-12-28 | 1984-07-14 | Toshiba Corp | Substrate for semiconductor |
JPH0359036B2 (en) * | 1982-12-28 | 1991-09-09 | Tokyo Shibaura Electric Co | |
JPS59190279A (en) * | 1983-04-13 | 1984-10-29 | 株式会社東芝 | Ceramic structure and manufacture |
JPH0247428B2 (en) * | 1983-04-13 | 1990-10-19 | Tokyo Shibaura Electric Co | |
JPS59203783A (en) * | 1983-04-28 | 1984-11-17 | 株式会社東芝 | Metallization of non-oxide ceramic sintered body |
JPS60178647A (en) * | 1984-02-27 | 1985-09-12 | Toshiba Corp | Semiconductor device |
JPS60178688A (en) * | 1984-02-27 | 1985-09-12 | 株式会社東芝 | High thermal conductivity circuit board |
JPH0576795B2 (en) * | 1984-02-27 | 1993-10-25 | Tokyo Shibaura Electric Co | |
JPS6184089A (en) * | 1984-10-01 | 1986-04-28 | 株式会社東芝 | High heat conductive circuit board |
JPH0568877B2 (en) * | 1984-11-15 | 1993-09-29 | Tokyo Shibaura Electric Co | |
JPS61119094A (en) * | 1984-11-15 | 1986-06-06 | 株式会社東芝 | High thermoconductive circuit board |
JPS61132580A (en) * | 1984-11-30 | 1986-06-20 | 京セラ株式会社 | Metallization of nitride ceramic body |
JPH0679988B2 (en) * | 1984-11-30 | 1994-10-12 | 京セラ株式会社 | Metallization method for nitride ceramics |
JPS61168938A (en) * | 1985-01-22 | 1986-07-30 | Toshiba Corp | Ceramic package and manufacture thereof |
JPS6246986A (en) * | 1985-08-22 | 1987-02-28 | 住友電気工業株式会社 | Aluminum nitride substrate and manufacture |
JPS6257239A (en) * | 1985-09-06 | 1987-03-12 | Hitachi Ltd | Aluminum nitride substrate for mounting semiconductor device and manufacture thereof |
JPS62197376A (en) * | 1986-02-20 | 1987-09-01 | 株式会社東芝 | Aluminum nitride substrate |
JPS62197377A (en) * | 1986-02-20 | 1987-09-01 | 株式会社東芝 | Substrate for ignitor |
JPS62197378A (en) * | 1986-02-20 | 1987-09-01 | 株式会社東芝 | Insulative substance for high frequency transistor |
JPS62207789A (en) * | 1986-03-08 | 1987-09-12 | 日本特殊陶業株式会社 | Surface structure for aluminum nitride material and manufacture |
JPH0569797B2 (en) * | 1986-03-08 | 1993-10-01 | Ngk Spark Plug Co | |
JPS62226879A (en) * | 1986-03-27 | 1987-10-05 | 株式会社東芝 | Aluminum nitride sintered body with sealed portion |
JPH0459779B2 (en) * | 1986-08-21 | 1992-09-24 | Tokyo Shibaura Electric Co | |
JPS6351662A (en) * | 1986-08-21 | 1988-03-04 | Toshiba Corp | Aluminum nitride substrate and manufacture thereof |
JPS63115393A (en) * | 1986-11-01 | 1988-05-19 | 株式会社住友金属セラミックス | High heat-conductivity circuit board |
JPH0571198B2 (en) * | 1986-11-01 | 1993-10-06 | Sumitomo Metal Ceramics Inc | |
US5529852A (en) * | 1987-01-26 | 1996-06-25 | Sumitomo Electric Industries, Ltd. | Aluminum nitride sintered body having a metallized coating layer on its surface |
JPS6490586A (en) * | 1987-10-01 | 1989-04-07 | Ngk Insulators Ltd | Aluminum nitride component and manufacture thereof |
US5637406A (en) * | 1989-03-31 | 1997-06-10 | Kabushiki Kaisha Toshiba | Metallized aluminum nitride substrate |
JP2004162147A (en) * | 2002-11-15 | 2004-06-10 | Plasma Giken Kogyo Kk | Aluminum nitride sintered body having thermal-sprayed coating |
JP2009143766A (en) * | 2007-12-14 | 2009-07-02 | Tokuyama Corp | Metallized substrate, and method of manufacturing the same |
KR20180084529A (en) | 2017-01-17 | 2018-07-25 | 주식회사 케이씨씨 | Ceramic circuit board and method of manufacturing the same |