JPS5073572A - - Google Patents
Info
- Publication number
- JPS5073572A JPS5073572A JP48122418A JP12241873A JPS5073572A JP S5073572 A JPS5073572 A JP S5073572A JP 48122418 A JP48122418 A JP 48122418A JP 12241873 A JP12241873 A JP 12241873A JP S5073572 A JPS5073572 A JP S5073572A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48122418A JPS588136B2 (en) | 1973-10-30 | 1973-10-30 | Soshitritsukeyoukitai |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48122418A JPS588136B2 (en) | 1973-10-30 | 1973-10-30 | Soshitritsukeyoukitai |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5073572A true JPS5073572A (en) | 1975-06-17 |
JPS588136B2 JPS588136B2 (en) | 1983-02-14 |
Family
ID=14835321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP48122418A Expired JPS588136B2 (en) | 1973-10-30 | 1973-10-30 | Soshitritsukeyoukitai |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS588136B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6016539U (en) * | 1983-07-08 | 1985-02-04 | 日立電線株式会社 | Support electrode plate for semiconductor devices |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4864879A (en) * | 1971-12-10 | 1973-09-07 |
-
1973
- 1973-10-30 JP JP48122418A patent/JPS588136B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4864879A (en) * | 1971-12-10 | 1973-09-07 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6016539U (en) * | 1983-07-08 | 1985-02-04 | 日立電線株式会社 | Support electrode plate for semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
JPS588136B2 (en) | 1983-02-14 |