JPS5073381U - - Google Patents
Info
- Publication number
- JPS5073381U JPS5073381U JP12859173U JP12859173U JPS5073381U JP S5073381 U JPS5073381 U JP S5073381U JP 12859173 U JP12859173 U JP 12859173U JP 12859173 U JP12859173 U JP 12859173U JP S5073381 U JPS5073381 U JP S5073381U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Wire Bonding (AREA)
- Electric Clocks (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12859173U JPS5073381U (enrdf_load_stackoverflow) | 1973-11-08 | 1973-11-08 | |
GB3096674A GB1468243A (en) | 1973-07-20 | 1974-07-12 | Electronic optical display timepiece |
DE19742434675 DE2434675C2 (de) | 1973-07-20 | 1974-07-18 | Elektronische Armbanduhr |
FR7425229A FR2238177B1 (enrdf_load_stackoverflow) | 1973-07-20 | 1974-07-19 | |
US05/521,532 US4042861A (en) | 1973-11-08 | 1974-11-06 | Mounting arrangement for an integrated circuit unit in an electronic digital watch |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12859173U JPS5073381U (enrdf_load_stackoverflow) | 1973-11-08 | 1973-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5073381U true JPS5073381U (enrdf_load_stackoverflow) | 1975-06-27 |
Family
ID=28384749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12859173U Pending JPS5073381U (enrdf_load_stackoverflow) | 1973-07-20 | 1973-11-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5073381U (enrdf_load_stackoverflow) |
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1973
- 1973-11-08 JP JP12859173U patent/JPS5073381U/ja active Pending