JPS5072583A - - Google Patents

Info

Publication number
JPS5072583A
JPS5072583A JP48120805A JP12080573A JPS5072583A JP S5072583 A JPS5072583 A JP S5072583A JP 48120805 A JP48120805 A JP 48120805A JP 12080573 A JP12080573 A JP 12080573A JP S5072583 A JPS5072583 A JP S5072583A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48120805A
Other languages
Japanese (ja)
Other versions
JPS529976B2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48120805A priority Critical patent/JPS529976B2/ja
Publication of JPS5072583A publication Critical patent/JPS5072583A/ja
Publication of JPS529976B2 publication Critical patent/JPS529976B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Control Of Position Or Direction (AREA)
  • Wire Bonding (AREA)
JP48120805A 1973-10-29 1973-10-29 Expired JPS529976B2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48120805A JPS529976B2 (enExample) 1973-10-29 1973-10-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48120805A JPS529976B2 (enExample) 1973-10-29 1973-10-29

Publications (2)

Publication Number Publication Date
JPS5072583A true JPS5072583A (enExample) 1975-06-16
JPS529976B2 JPS529976B2 (enExample) 1977-03-19

Family

ID=14795406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48120805A Expired JPS529976B2 (enExample) 1973-10-29 1973-10-29

Country Status (1)

Country Link
JP (1) JPS529976B2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279863U (enExample) * 1975-12-12 1977-06-14
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPS58191639U (ja) * 1982-06-16 1983-12-20 海上電機株式会社 デジタル制御されたボンデイングツ−ルのカム式上下駆動装置
JPH01144642A (ja) * 1988-07-08 1989-06-06 Nec Corp ワイヤボンデイング方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279863U (enExample) * 1975-12-12 1977-06-14
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPS58191639U (ja) * 1982-06-16 1983-12-20 海上電機株式会社 デジタル制御されたボンデイングツ−ルのカム式上下駆動装置
JPH01144642A (ja) * 1988-07-08 1989-06-06 Nec Corp ワイヤボンデイング方法

Also Published As

Publication number Publication date
JPS529976B2 (enExample) 1977-03-19

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