JPS5064767A - - Google Patents

Info

Publication number
JPS5064767A
JPS5064767A JP11387873A JP11387873A JPS5064767A JP S5064767 A JPS5064767 A JP S5064767A JP 11387873 A JP11387873 A JP 11387873A JP 11387873 A JP11387873 A JP 11387873A JP S5064767 A JPS5064767 A JP S5064767A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11387873A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11387873A priority Critical patent/JPS5064767A/ja
Publication of JPS5064767A publication Critical patent/JPS5064767A/ja
Pending legal-status Critical Current

Links

JP11387873A 1973-10-12 1973-10-12 Pending JPS5064767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11387873A JPS5064767A (en) 1973-10-12 1973-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11387873A JPS5064767A (en) 1973-10-12 1973-10-12

Publications (1)

Publication Number Publication Date
JPS5064767A true JPS5064767A (en) 1975-06-02

Family

ID=14623368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11387873A Pending JPS5064767A (en) 1973-10-12 1973-10-12

Country Status (1)

Country Link
JP (1) JPS5064767A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629400A (en) * 1979-08-20 1981-03-24 Nippon Electric Co Multilayer high density circuit board
JPS5662398A (en) * 1979-10-26 1981-05-28 Nippon Electric Co Method of manufacturing high density multilayer board
JPS58119694A (en) * 1982-01-12 1983-07-16 株式会社日立製作所 Method of producing circuit board
JPS58121698A (en) * 1982-01-12 1983-07-20 株式会社日立製作所 Multilayer printed board
JPS60113493A (en) * 1983-11-25 1985-06-19 富士通株式会社 Method of producing thick film multialyer circuit board
JPS61179597A (en) * 1985-02-04 1986-08-12 沖電気工業株式会社 Formation of multilayer interconnection
JPS61179598A (en) * 1985-02-04 1986-08-12 沖電気工業株式会社 Formation of multilayer interconnection
JPS61224398A (en) * 1985-03-29 1986-10-06 古河電気工業株式会社 Manufacture of multilayer printed circuit board
JPS62102543A (en) * 1985-10-28 1987-05-13 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Formation of conductive film and insulating film with same flat surface
JPH02290095A (en) * 1989-02-20 1990-11-29 Matsushita Electric Works Ltd Manufacture of multilayer interconnection board
US5480048A (en) * 1992-09-04 1996-01-02 Hitachi, Ltd. Multilayer wiring board fabricating method
JPH08321684A (en) * 1995-05-24 1996-12-03 Sony Corp Wiring board and manufacture thereof
USRE37882E1 (en) 1993-01-15 2002-10-15 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629400A (en) * 1979-08-20 1981-03-24 Nippon Electric Co Multilayer high density circuit board
JPH0139236B2 (en) * 1979-10-26 1989-08-18 Nippon Electric Co
JPS5662398A (en) * 1979-10-26 1981-05-28 Nippon Electric Co Method of manufacturing high density multilayer board
JPS58119694A (en) * 1982-01-12 1983-07-16 株式会社日立製作所 Method of producing circuit board
JPS58121698A (en) * 1982-01-12 1983-07-20 株式会社日立製作所 Multilayer printed board
JPH0544199B2 (en) * 1982-01-12 1993-07-05 Hitachi Ltd
JPH0451998B2 (en) * 1982-01-12 1992-08-20 Hitachi Ltd
JPS60113493A (en) * 1983-11-25 1985-06-19 富士通株式会社 Method of producing thick film multialyer circuit board
JPH0365032B2 (en) * 1983-11-25 1991-10-09
JPS61179597A (en) * 1985-02-04 1986-08-12 沖電気工業株式会社 Formation of multilayer interconnection
JPH0438157B2 (en) * 1985-02-04 1992-06-23 Oki Electric Ind Co Ltd
JPH0438158B2 (en) * 1985-02-04 1992-06-23 Oki Electric Ind Co Ltd
JPS61179598A (en) * 1985-02-04 1986-08-12 沖電気工業株式会社 Formation of multilayer interconnection
JPS61224398A (en) * 1985-03-29 1986-10-06 古河電気工業株式会社 Manufacture of multilayer printed circuit board
JPS62102543A (en) * 1985-10-28 1987-05-13 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Formation of conductive film and insulating film with same flat surface
JPH0817831A (en) * 1985-10-28 1996-01-19 Internatl Business Mach Corp <Ibm> Formation method of metal layer and silicon dioxide layer inidentical flat face
JPH02290095A (en) * 1989-02-20 1990-11-29 Matsushita Electric Works Ltd Manufacture of multilayer interconnection board
US5480048A (en) * 1992-09-04 1996-01-02 Hitachi, Ltd. Multilayer wiring board fabricating method
USRE37882E1 (en) 1993-01-15 2002-10-15 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method
JPH08321684A (en) * 1995-05-24 1996-12-03 Sony Corp Wiring board and manufacture thereof

Similar Documents

Publication Publication Date Title
AR201758A1 (en)
AU476761B2 (en)
AU465372B2 (en)
AR201235Q (en)
AR201231Q (en)
AU474593B2 (en)
AU474511B2 (en)
AU474838B2 (en)
AU465453B2 (en)
AU471343B2 (en)
AU465434B2 (en)
AU450229B2 (en)
JPS5064767A (en)
AU476714B2 (en)
AR201229Q (en)
AU476696B2 (en)
AU472848B2 (en)
AU466283B2 (en)
AR199451A1 (en)
AU477823B2 (en)
AU447540B2 (en)
AU477824B2 (en)
AU461342B2 (en)
AU471461B2 (en)
AR195311A1 (en)