JPS59122904A
(ja)
*
|
1982-12-28 |
1984-07-16 |
Jeol Ltd |
イオンビ−ム膜厚測定装置
|
JPH01308939A
(ja)
*
|
1989-03-28 |
1989-12-13 |
Showa Alum Corp |
金属材中のガス分析装置
|
JPH01308938A
(ja)
*
|
1989-03-28 |
1989-12-13 |
Showa Alum Corp |
金属材中のガス分析装置
|
US6940296B2
(en)
|
1998-11-30 |
2005-09-06 |
Fab Solutions, Inc. |
Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer
|
US7232994B2
(en)
|
1998-11-30 |
2007-06-19 |
Fab Solutions, Inc. |
Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer
|
US6982418B2
(en)
|
1998-11-30 |
2006-01-03 |
Fab Solutions, Inc. |
Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer
|
US6897440B1
(en)
|
1998-11-30 |
2005-05-24 |
Fab Solutions, Inc. |
Contact hole standard test device
|
US6967327B2
(en)
|
1998-11-30 |
2005-11-22 |
Fab Solutions, Inc. |
Contact hole standard test device, method of forming the same, method testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer
|
US6946857B2
(en)
|
1999-11-05 |
2005-09-20 |
Fab Solutions, Inc. |
Semiconductor device tester
|
US7385195B2
(en)
|
1999-11-05 |
2008-06-10 |
Topcon Corporation |
Semiconductor device tester
|
US6975125B2
(en)
|
1999-11-05 |
2005-12-13 |
Fab Solutions, Inc. |
Semiconductor device tester
|
US6900645B2
(en)
|
2000-05-30 |
2005-05-31 |
Fab Solutions, Inc. |
Semiconductor device test method and semiconductor device tester
|
US6914444B2
(en)
|
2000-05-30 |
2005-07-05 |
Fab Solutions, Inc. |
Semiconductor device test method and semiconductor device tester
|
US7049834B2
(en)
|
2000-05-30 |
2006-05-23 |
Fab Solutions, Inc |
Semiconductor device test method and semiconductor device tester
|
US6809534B2
(en)
|
2000-05-30 |
2004-10-26 |
Fab Solutions, Inc. |
Semiconductor device test method and semiconductor device tester
|
US7550982B2
(en)
|
2000-05-30 |
2009-06-23 |
Topcon Corporation |
Semiconductor device test method for comparing a first area with a second area
|
US7321805B2
(en)
|
2001-03-01 |
2008-01-22 |
Fab Solutions, Inc. |
Production managing system of semiconductor device
|
US6943043B2
(en)
|
2001-03-02 |
2005-09-13 |
Fab Solutions, Inc. |
Surface contamination analyzer for semiconductor wafers, method used therein and process for fabricating semiconductor device
|
US7700380B2
(en)
|
2001-03-02 |
2010-04-20 |
Topcon Corporation |
Surface contamination analyzer for semiconductor wafers, method used therein and process for fabricating semiconductor device
|
US7795593B2
(en)
|
2001-03-02 |
2010-09-14 |
Topcon Corporation |
Surface contamination analyzer for semiconductor wafers
|
US6850079B2
(en)
|
2002-01-17 |
2005-02-01 |
Fab Solutions, Inc. |
Film thickness measuring apparatus and a method for measuring a thickness of a film
|
US7002361B2
(en)
|
2002-01-17 |
2006-02-21 |
Fab Solutions, Inc. |
Film thickness measuring apparatus and a method for measuring a thickness of a film
|