JPS506279A - - Google Patents
Info
- Publication number
- JPS506279A JPS506279A JP5463173A JP5463173A JPS506279A JP S506279 A JPS506279 A JP S506279A JP 5463173 A JP5463173 A JP 5463173A JP 5463173 A JP5463173 A JP 5463173A JP S506279 A JPS506279 A JP S506279A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5463173A JPS5226989B2 (https=) | 1973-05-18 | 1973-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5463173A JPS5226989B2 (https=) | 1973-05-18 | 1973-05-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS506279A true JPS506279A (https=) | 1975-01-22 |
| JPS5226989B2 JPS5226989B2 (https=) | 1977-07-18 |
Family
ID=12976089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5463173A Expired JPS5226989B2 (https=) | 1973-05-18 | 1973-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5226989B2 (https=) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54173668U (https=) * | 1978-05-29 | 1979-12-07 | ||
| JPS56150830A (en) * | 1980-04-25 | 1981-11-21 | Hitachi Ltd | Semiconductor device |
| JPS57188853A (en) * | 1981-05-18 | 1982-11-19 | Hitachi Ltd | Plastic molded type semiconductor device |
| JPS58118297A (ja) * | 1981-12-31 | 1983-07-14 | 共同印刷株式会社 | 識別カ−ドの製造方法 |
| JPS6097646A (ja) * | 1983-10-31 | 1985-05-31 | Nitto Electric Ind Co Ltd | 半導体装置 |
| US4758875A (en) * | 1981-04-30 | 1988-07-19 | Hitachi, Ltd. | Resin encapsulated semiconductor device |
| JPH02125644A (ja) * | 1988-11-05 | 1990-05-14 | Seiko Epson Corp | 樹脂封止半導体装置 |
| US4933744A (en) * | 1980-09-22 | 1990-06-12 | Hitachi, Ltd. | Resin encapsulated electronic devices |
-
1973
- 1973-05-18 JP JP5463173A patent/JPS5226989B2/ja not_active Expired
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54173668U (https=) * | 1978-05-29 | 1979-12-07 | ||
| JPS56150830A (en) * | 1980-04-25 | 1981-11-21 | Hitachi Ltd | Semiconductor device |
| US4933744A (en) * | 1980-09-22 | 1990-06-12 | Hitachi, Ltd. | Resin encapsulated electronic devices |
| US4758875A (en) * | 1981-04-30 | 1988-07-19 | Hitachi, Ltd. | Resin encapsulated semiconductor device |
| JPS57188853A (en) * | 1981-05-18 | 1982-11-19 | Hitachi Ltd | Plastic molded type semiconductor device |
| JPS58118297A (ja) * | 1981-12-31 | 1983-07-14 | 共同印刷株式会社 | 識別カ−ドの製造方法 |
| JPS6097646A (ja) * | 1983-10-31 | 1985-05-31 | Nitto Electric Ind Co Ltd | 半導体装置 |
| JPH02125644A (ja) * | 1988-11-05 | 1990-05-14 | Seiko Epson Corp | 樹脂封止半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5226989B2 (https=) | 1977-07-18 |