JPS505914B1 - - Google Patents
Info
- Publication number
- JPS505914B1 JPS505914B1 JP4647170A JP4647170A JPS505914B1 JP S505914 B1 JPS505914 B1 JP S505914B1 JP 4647170 A JP4647170 A JP 4647170A JP 4647170 A JP4647170 A JP 4647170A JP S505914 B1 JPS505914 B1 JP S505914B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4647170A JPS505914B1 (ja) | 1970-05-29 | 1970-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4647170A JPS505914B1 (ja) | 1970-05-29 | 1970-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS505914B1 true JPS505914B1 (ja) | 1975-03-08 |
Family
ID=12748080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4647170A Pending JPS505914B1 (ja) | 1970-05-29 | 1970-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS505914B1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61118576A (ja) * | 1984-11-13 | 1986-06-05 | テクムゼ・プロダクツ・カンパニー | 回転圧縮機およびその吸込管密封方法 |
-
1970
- 1970-05-29 JP JP4647170A patent/JPS505914B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61118576A (ja) * | 1984-11-13 | 1986-06-05 | テクムゼ・プロダクツ・カンパニー | 回転圧縮機およびその吸込管密封方法 |