JPS5051260A - - Google Patents
Info
- Publication number
- JPS5051260A JPS5051260A JP48100171A JP10017173A JPS5051260A JP S5051260 A JPS5051260 A JP S5051260A JP 48100171 A JP48100171 A JP 48100171A JP 10017173 A JP10017173 A JP 10017173A JP S5051260 A JPS5051260 A JP S5051260A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/50—
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- H10W72/07551—
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- H10W72/07553—
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- H10W72/531—
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- H10W72/5449—
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- H10W72/581—
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- H10W90/754—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48100171A JPS5051260A (ja) | 1973-09-07 | 1973-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48100171A JPS5051260A (ja) | 1973-09-07 | 1973-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5051260A true JPS5051260A (ja) | 1975-05-08 |
Family
ID=14266862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48100171A Pending JPS5051260A (ja) | 1973-09-07 | 1973-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5051260A (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57140738U (ja) * | 1981-02-26 | 1982-09-03 | ||
| JPS6173344A (ja) * | 1984-09-17 | 1986-04-15 | Rohm Co Ltd | 半導体装置 |
| JPH02257646A (ja) * | 1989-03-29 | 1990-10-18 | Mitsubishi Electric Corp | 半導体装置 |
| CN116093058A (zh) * | 2023-02-28 | 2023-05-09 | 中科华艺(天津)科技有限公司 | 一种氮化镓半导体抗干扰封装结构 |
| DE102019200634B4 (de) | 2018-02-05 | 2023-06-29 | Kabushiki Kaisha Toshiba | Verfahren zur Herstellung eines Halbleitermoduls |
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1973
- 1973-09-07 JP JP48100171A patent/JPS5051260A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57140738U (ja) * | 1981-02-26 | 1982-09-03 | ||
| JPS6173344A (ja) * | 1984-09-17 | 1986-04-15 | Rohm Co Ltd | 半導体装置 |
| JPH02257646A (ja) * | 1989-03-29 | 1990-10-18 | Mitsubishi Electric Corp | 半導体装置 |
| DE102019200634B4 (de) | 2018-02-05 | 2023-06-29 | Kabushiki Kaisha Toshiba | Verfahren zur Herstellung eines Halbleitermoduls |
| CN116093058A (zh) * | 2023-02-28 | 2023-05-09 | 中科华艺(天津)科技有限公司 | 一种氮化镓半导体抗干扰封装结构 |
| CN116093058B (zh) * | 2023-02-28 | 2024-01-09 | 中科华艺(天津)科技有限公司 | 一种氮化镓半导体抗干扰封装结构 |