JPS5050411A - - Google Patents
Info
- Publication number
- JPS5050411A JPS5050411A JP48099217A JP9921773A JPS5050411A JP S5050411 A JPS5050411 A JP S5050411A JP 48099217 A JP48099217 A JP 48099217A JP 9921773 A JP9921773 A JP 9921773A JP S5050411 A JPS5050411 A JP S5050411A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9921773A JPS5710351B2 (enExample) | 1973-09-05 | 1973-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9921773A JPS5710351B2 (enExample) | 1973-09-05 | 1973-09-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5050411A true JPS5050411A (enExample) | 1975-05-06 |
| JPS5710351B2 JPS5710351B2 (enExample) | 1982-02-25 |
Family
ID=14241479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9921773A Expired JPS5710351B2 (enExample) | 1973-09-05 | 1973-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5710351B2 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5229656U (enExample) * | 1975-07-31 | 1977-03-02 | ||
| JPS5478670A (en) * | 1977-12-05 | 1979-06-22 | Nippon Telegr & Teleph Corp <Ntt> | High-density packing integrated circuit substrate device |
| WO2023190524A1 (ja) * | 2022-03-30 | 2023-10-05 | 京セラ株式会社 | 放熱板及びベイパーチャンバー |
| JP2024149708A (ja) * | 2020-11-05 | 2024-10-18 | 東京エレクトロン株式会社 | 基板保持体、基板搬送装置及び基板保持体の製造方法 |
-
1973
- 1973-09-05 JP JP9921773A patent/JPS5710351B2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5229656U (enExample) * | 1975-07-31 | 1977-03-02 | ||
| JPS5478670A (en) * | 1977-12-05 | 1979-06-22 | Nippon Telegr & Teleph Corp <Ntt> | High-density packing integrated circuit substrate device |
| JP2024149708A (ja) * | 2020-11-05 | 2024-10-18 | 東京エレクトロン株式会社 | 基板保持体、基板搬送装置及び基板保持体の製造方法 |
| WO2023190524A1 (ja) * | 2022-03-30 | 2023-10-05 | 京セラ株式会社 | 放熱板及びベイパーチャンバー |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5710351B2 (enExample) | 1982-02-25 |