JPS504575A - - Google Patents

Info

Publication number
JPS504575A
JPS504575A JP5463473A JP5463473A JPS504575A JP S504575 A JPS504575 A JP S504575A JP 5463473 A JP5463473 A JP 5463473A JP 5463473 A JP5463473 A JP 5463473A JP S504575 A JPS504575 A JP S504575A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5463473A
Other versions
JPS5619102B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5463473A priority Critical patent/JPS5619102B2/ja
Publication of JPS504575A publication Critical patent/JPS504575A/ja
Publication of JPS5619102B2 publication Critical patent/JPS5619102B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP5463473A 1973-05-18 1973-05-18 Expired JPS5619102B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5463473A JPS5619102B2 (ja) 1973-05-18 1973-05-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5463473A JPS5619102B2 (ja) 1973-05-18 1973-05-18

Publications (2)

Publication Number Publication Date
JPS504575A true JPS504575A (ja) 1975-01-17
JPS5619102B2 JPS5619102B2 (ja) 1981-05-06

Family

ID=12976180

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5463473A Expired JPS5619102B2 (ja) 1973-05-18 1973-05-18

Country Status (1)

Country Link
JP (1) JPS5619102B2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53149669A (en) * 1977-06-01 1978-12-27 Hitachi Ltd Method of forming multilayer circuit layer having resistance layer
JPS6136142A (ja) * 1984-07-27 1986-02-20 新東工業株式会社 消石灰粉・消石灰込合粉の乾式造粒方法
JPS61271897A (ja) * 1985-05-27 1986-12-02 京セラ株式会社 多層配線回路基板及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619733A (en) * 1969-08-18 1971-11-09 Rca Corp Semiconductor device with multilevel metalization and method of making the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619733A (en) * 1969-08-18 1971-11-09 Rca Corp Semiconductor device with multilevel metalization and method of making the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53149669A (en) * 1977-06-01 1978-12-27 Hitachi Ltd Method of forming multilayer circuit layer having resistance layer
JPS6136142A (ja) * 1984-07-27 1986-02-20 新東工業株式会社 消石灰粉・消石灰込合粉の乾式造粒方法
JPS61271897A (ja) * 1985-05-27 1986-12-02 京セラ株式会社 多層配線回路基板及びその製造方法

Also Published As

Publication number Publication date
JPS5619102B2 (ja) 1981-05-06

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