JPS5040549Y2 - - Google Patents

Info

Publication number
JPS5040549Y2
JPS5040549Y2 JP1971114942U JP11494271U JPS5040549Y2 JP S5040549 Y2 JPS5040549 Y2 JP S5040549Y2 JP 1971114942 U JP1971114942 U JP 1971114942U JP 11494271 U JP11494271 U JP 11494271U JP S5040549 Y2 JPS5040549 Y2 JP S5040549Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1971114942U
Other languages
Japanese (ja)
Other versions
JPS4870557U (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1971114942U priority Critical patent/JPS5040549Y2/ja
Publication of JPS4870557U publication Critical patent/JPS4870557U/ja
Application granted granted Critical
Publication of JPS5040549Y2 publication Critical patent/JPS5040549Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1971114942U 1971-12-07 1971-12-07 Expired JPS5040549Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1971114942U JPS5040549Y2 (https=) 1971-12-07 1971-12-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1971114942U JPS5040549Y2 (https=) 1971-12-07 1971-12-07

Publications (2)

Publication Number Publication Date
JPS4870557U JPS4870557U (https=) 1973-09-05
JPS5040549Y2 true JPS5040549Y2 (https=) 1975-11-19

Family

ID=28027125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1971114942U Expired JPS5040549Y2 (https=) 1971-12-07 1971-12-07

Country Status (1)

Country Link
JP (1) JPS5040549Y2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60149137U (ja) * 1984-03-13 1985-10-03 株式会社東芝 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS4870557U (https=) 1973-09-05

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