JPS5037365A - - Google Patents

Info

Publication number
JPS5037365A
JPS5037365A JP8754573A JP8754573A JPS5037365A JP S5037365 A JPS5037365 A JP S5037365A JP 8754573 A JP8754573 A JP 8754573A JP 8754573 A JP8754573 A JP 8754573A JP S5037365 A JPS5037365 A JP S5037365A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8754573A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8754573A priority Critical patent/JPS5037365A/ja
Publication of JPS5037365A publication Critical patent/JPS5037365A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Die Bonding (AREA)
JP8754573A 1973-08-06 1973-08-06 Pending JPS5037365A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8754573A JPS5037365A (ja) 1973-08-06 1973-08-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8754573A JPS5037365A (ja) 1973-08-06 1973-08-06

Publications (1)

Publication Number Publication Date
JPS5037365A true JPS5037365A (ja) 1975-04-08

Family

ID=13917939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8754573A Pending JPS5037365A (ja) 1973-08-06 1973-08-06

Country Status (1)

Country Link
JP (1) JPS5037365A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421261A (en) * 1977-07-19 1979-02-17 Nec Home Electronics Ltd Manufacture for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421261A (en) * 1977-07-19 1979-02-17 Nec Home Electronics Ltd Manufacture for semiconductor device

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