JPS5034173A - - Google Patents

Info

Publication number
JPS5034173A
JPS5034173A JP6825074A JP6825074A JPS5034173A JP S5034173 A JPS5034173 A JP S5034173A JP 6825074 A JP6825074 A JP 6825074A JP 6825074 A JP6825074 A JP 6825074A JP S5034173 A JPS5034173 A JP S5034173A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6825074A
Other versions
JPS5422876B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5034173A publication Critical patent/JPS5034173A/ja
Publication of JPS5422876B2 publication Critical patent/JPS5422876B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W40/73—
    • H10W40/611—
    • H10W72/00—
    • H10W76/138—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP6825074A 1973-06-18 1974-06-17 Expired JPS5422876B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US37083873 US3852803A (en) 1973-06-18 1973-06-18 Heat sink cooled power semiconductor device assembly having liquid metal interface

Publications (2)

Publication Number Publication Date
JPS5034173A true JPS5034173A (ja) 1975-04-02
JPS5422876B2 JPS5422876B2 (ja) 1979-08-09

Family

ID=23461399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6825074A Expired JPS5422876B2 (ja) 1973-06-18 1974-06-17

Country Status (8)

Country Link
US (1) US3852803A (ja)
JP (1) JPS5422876B2 (ja)
CA (1) CA1010576A (ja)
DE (1) DE2428934A1 (ja)
FR (1) FR2233710B1 (ja)
GB (1) GB1471495A (ja)
IT (1) IT1015101B (ja)
SE (1) SE401057B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59186003A (ja) * 1983-04-06 1984-10-22 アムペックス　コーポレーシヨン サ−ボ制御方式

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3984861A (en) * 1975-01-09 1976-10-05 Rca Corporation Transcallent semiconductor device
CS179822B1 (en) * 1975-09-08 1977-11-30 Petr Novak Cooling and pressuring equipment esp. for power semiconductive elements
US3978518A (en) * 1975-11-12 1976-08-31 Rca Corporation Reinforced transcalent device
DE2556749A1 (de) * 1975-12-17 1977-06-23 Bbc Brown Boveri & Cie Leistungshalbleiterbauelement in scheibenzellenbauweise
CS182611B1 (en) * 1976-03-18 1978-04-28 Pavel Reichel Power semiconducting element
US4145708A (en) * 1977-06-13 1979-03-20 General Electric Company Power module with isolated substrates cooled by integral heat-energy-removal means
US4327370A (en) * 1979-06-28 1982-04-27 Rca Corporation Resilient contact ring for providing a low impedance connection to the base region of a semiconductor device
US4715438A (en) * 1986-06-30 1987-12-29 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
WO1988000393A1 (en) * 1986-06-30 1988-01-14 Unisys Corporation Reduced-stress heat sink device
FR2604028B1 (fr) * 1986-09-16 1990-01-26 Alsthom Dispositif de refroidissement de semi-conducteurs par vaporisation d'un fluide frigorifique
JPH0770650B2 (ja) * 1986-10-20 1995-07-31 富士通株式会社 半導体装置の冷却方法
JP3067399B2 (ja) * 1992-07-03 2000-07-17 株式会社日立製作所 半導体冷却装置
BRPI0806533B1 (pt) * 2007-01-26 2018-10-09 Inductotherm Corp. dispositivo de fixação de semicondutor para fixar um conjunto semicondutor e método de fixar um conjunto semicondutor
FR2945376B1 (fr) * 2009-05-06 2012-06-29 Commissariat Energie Atomique Recepteur solaire hybride pour la production d'electricite et de chaleur et systeme solaire a concentration comportant un tel recepteur
US8477500B2 (en) 2010-05-25 2013-07-02 General Electric Company Locking device and method for making the same
US9507391B2 (en) * 2011-11-28 2016-11-29 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Heat sink with orientable fins
US9826662B2 (en) 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
CN115993516B (zh) * 2023-03-23 2023-06-20 深圳平创半导体有限公司 一种压接型功率半导体器件内部结温分布测量方法及系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3226608A (en) * 1959-06-24 1965-12-28 Gen Electric Liquid metal electrical connection
US3248615A (en) * 1963-05-13 1966-04-26 Bbc Brown Boveri & Cie Semiconductor device with liquidized solder layer for compensation of expansion stresses
US3457472A (en) * 1966-10-10 1969-07-22 Gen Electric Semiconductor devices adapted for pressure mounting
US3746947A (en) * 1969-03-15 1973-07-17 Mitsubishi Electric Corp Semiconductor device
SE354943B (ja) * 1970-02-24 1973-03-26 Asea Ab
US3673306A (en) * 1970-11-02 1972-06-27 Trw Inc Fluid heat transfer method and apparatus for semi-conducting devices
US3739235A (en) * 1972-01-31 1973-06-12 Rca Corp Transcalent semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59186003A (ja) * 1983-04-06 1984-10-22 アムペックス　コーポレーシヨン サ−ボ制御方式

Also Published As

Publication number Publication date
SE401057B (sv) 1978-04-17
FR2233710B1 (ja) 1978-04-28
GB1471495A (en) 1977-04-27
CA1010576A (en) 1977-05-17
FR2233710A1 (ja) 1975-01-10
SE7407940L (ja) 1974-12-19
US3852803A (en) 1974-12-03
DE2428934A1 (de) 1975-01-16
IT1015101B (it) 1977-05-10
JPS5422876B2 (ja) 1979-08-09

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