JPS5034170A - - Google Patents
Info
- Publication number
- JPS5034170A JPS5034170A JP48084120A JP8412073A JPS5034170A JP S5034170 A JPS5034170 A JP S5034170A JP 48084120 A JP48084120 A JP 48084120A JP 8412073 A JP8412073 A JP 8412073A JP S5034170 A JPS5034170 A JP S5034170A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48084120A JPS5034170A (th) | 1973-07-27 | 1973-07-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48084120A JPS5034170A (th) | 1973-07-27 | 1973-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5034170A true JPS5034170A (th) | 1975-04-02 |
Family
ID=13821647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP48084120A Pending JPS5034170A (th) | 1973-07-27 | 1973-07-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5034170A (th) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5374365A (en) * | 1976-12-15 | 1978-07-01 | Toshiba Corp | Semiconductor ceramic package |
JPS61255247A (ja) * | 1985-05-08 | 1986-11-12 | アウデイ アクチエンゲゼルシヤフト | 液冷式シリンダヘツド |
JPS63197334U (th) * | 1987-06-10 | 1988-12-19 | ||
JP2014022576A (ja) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | 半導体素子実装部材及び半導体装置 |
JP2016184756A (ja) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |
JP2020004806A (ja) * | 2018-06-26 | 2020-01-09 | 住友電工デバイス・イノベーション株式会社 | 半導体装置、および、半導体チップの搭載方法 |
-
1973
- 1973-07-27 JP JP48084120A patent/JPS5034170A/ja active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5374365A (en) * | 1976-12-15 | 1978-07-01 | Toshiba Corp | Semiconductor ceramic package |
JPS5625023B2 (th) * | 1976-12-15 | 1981-06-10 | ||
JPS61255247A (ja) * | 1985-05-08 | 1986-11-12 | アウデイ アクチエンゲゼルシヤフト | 液冷式シリンダヘツド |
JPS63197334U (th) * | 1987-06-10 | 1988-12-19 | ||
JP2014022576A (ja) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | 半導体素子実装部材及び半導体装置 |
JP2016184756A (ja) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |
JP2020004806A (ja) * | 2018-06-26 | 2020-01-09 | 住友電工デバイス・イノベーション株式会社 | 半導体装置、および、半導体チップの搭載方法 |