JPS503387A - - Google Patents
Info
- Publication number
- JPS503387A JPS503387A JP5201173A JP5201173A JPS503387A JP S503387 A JPS503387 A JP S503387A JP 5201173 A JP5201173 A JP 5201173A JP 5201173 A JP5201173 A JP 5201173A JP S503387 A JPS503387 A JP S503387A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5201173A JPS503387A (ja) | 1973-05-10 | 1973-05-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5201173A JPS503387A (ja) | 1973-05-10 | 1973-05-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS503387A true JPS503387A (ja) | 1975-01-14 |
Family
ID=12902861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5201173A Pending JPS503387A (ja) | 1973-05-10 | 1973-05-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS503387A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59166825A (ja) * | 1983-03-11 | 1984-09-20 | Seiko Epson Corp | 温度検出回路 |
JPS59174725A (ja) * | 1983-03-22 | 1984-10-03 | ボーソーペ コンポーネンツ リミテッド | 温度検知器 |
WO2012035938A1 (ja) * | 2010-09-14 | 2012-03-22 | 株式会社村田製作所 | 半導体セラミック素子およびその製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4833375B1 (ja) * | 1967-06-07 | 1973-10-13 |
-
1973
- 1973-05-10 JP JP5201173A patent/JPS503387A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4833375B1 (ja) * | 1967-06-07 | 1973-10-13 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59166825A (ja) * | 1983-03-11 | 1984-09-20 | Seiko Epson Corp | 温度検出回路 |
JPS59174725A (ja) * | 1983-03-22 | 1984-10-03 | ボーソーペ コンポーネンツ リミテッド | 温度検知器 |
JPH0225129B2 (ja) * | 1983-03-22 | 1990-05-31 | Stc Plc | |
WO2012035938A1 (ja) * | 2010-09-14 | 2012-03-22 | 株式会社村田製作所 | 半導体セラミック素子およびその製造方法 |
CN103098149A (zh) * | 2010-09-14 | 2013-05-08 | 株式会社村田制作所 | 半导体陶瓷元件及其制造方法 |
US8624703B2 (en) | 2010-09-14 | 2014-01-07 | Murata Manufacturing Co., Ltd. | Semiconductor ceramic element and method for producing same |
JP5423899B2 (ja) * | 2010-09-14 | 2014-02-19 | 株式会社村田製作所 | 半導体セラミック素子およびその製造方法 |