JPS5032197B1 - - Google Patents

Info

Publication number
JPS5032197B1
JPS5032197B1 JP45104414A JP10441470A JPS5032197B1 JP S5032197 B1 JPS5032197 B1 JP S5032197B1 JP 45104414 A JP45104414 A JP 45104414A JP 10441470 A JP10441470 A JP 10441470A JP S5032197 B1 JPS5032197 B1 JP S5032197B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45104414A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5032197B1 publication Critical patent/JPS5032197B1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • H10W72/073—
    • H10W72/07336—
    • H10W72/352—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
JP45104414A 1970-07-03 1970-11-26 Pending JPS5032197B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2032939A DE2032939B2 (de) 1970-07-03 1970-07-03 Verfahren zum Auflöten eines Halbleiterkörpers auf einen Träger

Publications (1)

Publication Number Publication Date
JPS5032197B1 true JPS5032197B1 (ja) 1975-10-18

Family

ID=5775669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45104414A Pending JPS5032197B1 (ja) 1970-07-03 1970-11-26

Country Status (2)

Country Link
JP (1) JPS5032197B1 (ja)
DE (1) DE2032939B2 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4117969A (en) * 1975-10-22 1978-10-03 Japan Storage Battery Company Limited Method for interconnecting adjacent electric storage batteries
DE3226554A1 (de) * 1982-07-16 1984-01-19 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zur verloetung eines loetfaehigen plaettchens mit einem traeger
DE3442537A1 (de) * 1984-11-22 1986-05-22 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Verfahren zum blasenfreien verbinden eines grossflaechigen halbleiter-bauelements mit einem als substrat dienenden bauteil mittels loeten
US4709849A (en) * 1985-11-27 1987-12-01 Fry Metals, Inc. Solder preform and methods employing the same
DE3777522D1 (de) * 1986-10-17 1992-04-23 Hitachi Ltd Verfahren zum herstellen einer gemischten struktur fuer halbleiteranordnung.
US4851966A (en) * 1986-11-10 1989-07-25 Motorola, Inc. Method and apparatus of printed circuit board assembly with optimal placement of components
DE4220875A1 (de) * 1992-06-25 1994-01-13 Eupec Gmbh & Co Kg Verfahren zum Verbinden eines Halbleiterkörpers mit Kontaktscheiben
DE4235908A1 (de) * 1992-10-23 1994-04-28 Telefunken Microelectron Verfahren zum Verlöten eines Halbleiterkörpers mit einem Trägerelement
JP3136390B2 (ja) * 1994-12-16 2001-02-19 株式会社日立製作所 半田接合方法及びパワー半導体装置
GB2372005A (en) * 2001-02-03 2002-08-14 Marconi Caswell Ltd A method of soldering and a preform therefor
DE102005003812A1 (de) 2005-01-27 2006-10-05 Abb Technology Ag Verfahren zur Herstellung eines Kontaktstückes, sowie Kontaktstück für eine Vakuumschaltkammer selbst
US8678271B2 (en) 2007-06-26 2014-03-25 Globalfoundries Inc. Method for preventing void formation in a solder joint

Also Published As

Publication number Publication date
DE2032939B2 (de) 1975-05-07
DE2032939A1 (en) 1972-01-13

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