JPS5030744A - - Google Patents
Info
- Publication number
- JPS5030744A JPS5030744A JP8222973A JP8222973A JPS5030744A JP S5030744 A JPS5030744 A JP S5030744A JP 8222973 A JP8222973 A JP 8222973A JP 8222973 A JP8222973 A JP 8222973A JP S5030744 A JPS5030744 A JP S5030744A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8222973A JPS5248580B2 (en) | 1973-07-21 | 1973-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8222973A JPS5248580B2 (en) | 1973-07-21 | 1973-07-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5030744A true JPS5030744A (en) | 1975-03-27 |
| JPS5248580B2 JPS5248580B2 (en) | 1977-12-10 |
Family
ID=13768563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8222973A Expired JPS5248580B2 (en) | 1973-07-21 | 1973-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5248580B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4265943A (en) * | 1978-11-27 | 1981-05-05 | Macdermid Incorporated | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions |
| JPH0238580A (en) * | 1988-07-28 | 1990-02-07 | Hitachi Chem Co Ltd | Electroless copper plating method |
| JPH02141581A (en) * | 1988-11-22 | 1990-05-30 | Hitachi Chem Co Ltd | Electroless copper plating method |
| JP2011231382A (en) * | 2010-04-28 | 2011-11-17 | Nagoya Plating Co Ltd | Plating liquid for polymer fiber, method for plating polymer fiber using the same, and method for producing the same |
| CN102534583A (en) * | 2010-12-08 | 2012-07-04 | 比亚迪股份有限公司 | Chemical copper-plating solution and chemical copper-plating method |
-
1973
- 1973-07-21 JP JP8222973A patent/JPS5248580B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4265943A (en) * | 1978-11-27 | 1981-05-05 | Macdermid Incorporated | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions |
| JPH0238580A (en) * | 1988-07-28 | 1990-02-07 | Hitachi Chem Co Ltd | Electroless copper plating method |
| JPH02141581A (en) * | 1988-11-22 | 1990-05-30 | Hitachi Chem Co Ltd | Electroless copper plating method |
| JP2011231382A (en) * | 2010-04-28 | 2011-11-17 | Nagoya Plating Co Ltd | Plating liquid for polymer fiber, method for plating polymer fiber using the same, and method for producing the same |
| CN102534583A (en) * | 2010-12-08 | 2012-07-04 | 比亚迪股份有限公司 | Chemical copper-plating solution and chemical copper-plating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5248580B2 (en) | 1977-12-10 |