JPS5030146A - - Google Patents

Info

Publication number
JPS5030146A
JPS5030146A JP48078191A JP7819173A JPS5030146A JP S5030146 A JPS5030146 A JP S5030146A JP 48078191 A JP48078191 A JP 48078191A JP 7819173 A JP7819173 A JP 7819173A JP S5030146 A JPS5030146 A JP S5030146A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48078191A
Other versions
JPS5228260B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48078191A priority Critical patent/JPS5228260B2/ja
Priority to US05/487,650 priority patent/US3980133A/en
Publication of JPS5030146A publication Critical patent/JPS5030146A/ja
Publication of JPS5228260B2 publication Critical patent/JPS5228260B2/ja
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • H10W40/73—

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
JP48078191A 1973-07-11 1973-07-11 Expired JPS5228260B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP48078191A JPS5228260B2 (ja) 1973-07-11 1973-07-11
US05/487,650 US3980133A (en) 1973-07-11 1974-07-11 Heat transferring apparatus utilizing phase transition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48078191A JPS5228260B2 (ja) 1973-07-11 1973-07-11

Publications (2)

Publication Number Publication Date
JPS5030146A true JPS5030146A (ja) 1975-03-26
JPS5228260B2 JPS5228260B2 (ja) 1977-07-26

Family

ID=13655085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48078191A Expired JPS5228260B2 (ja) 1973-07-11 1973-07-11

Country Status (2)

Country Link
US (1) US3980133A (ja)
JP (1) JPS5228260B2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5514994U (ja) * 1979-04-26 1980-01-30

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4757370A (en) * 1987-01-12 1988-07-12 International Business Machines Corp. Circuit package cooling technique with liquid film spreading downward across package surface without separation
US4912548A (en) * 1987-01-28 1990-03-27 National Semiconductor Corporation Use of a heat pipe integrated with the IC package for improving thermal performance
US5405808A (en) * 1993-08-16 1995-04-11 Lsi Logic Corporation Fluid-filled and gas-filled semiconductor packages
US7265979B2 (en) * 2004-06-24 2007-09-04 Intel Corporation Cooling integrated circuits using a cold plate with two phase thin film evaporation
US20100326627A1 (en) * 2009-06-30 2010-12-30 Schon Steven G Microelectronics cooling system
TWM400605U (en) * 2010-11-09 2011-03-21 Sunteng New Technology Co Ltd Improved heat dissipating structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1275946A (en) * 1969-01-28 1972-06-01 Messerschmitt Boelkow Blohm Apparatus for the conduction or exchange of heat
US3661202A (en) * 1970-07-06 1972-05-09 Robert David Moore Jr Heat transfer apparatus with improved heat transfer surface
US3620298A (en) * 1970-07-22 1971-11-16 Mc Donnell Douglas Corp Continuous heat pipe and artery connector therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5514994U (ja) * 1979-04-26 1980-01-30

Also Published As

Publication number Publication date
JPS5228260B2 (ja) 1977-07-26
US3980133A (en) 1976-09-14

Similar Documents

Publication Publication Date Title
AR201758A1 (ja)
AU476761B2 (ja)
AU465372B2 (ja)
AR201235Q (ja)
AR201231Q (ja)
AU465434B2 (ja)
AU450229B2 (ja)
AR201229Q (ja)
AU477823B2 (ja)
AR200885A1 (ja)
AR210729A1 (ja)
AU477824B2 (ja)
AR201432A1 (ja)
AU447540B2 (ja)
AR195948A1 (ja)
AU461342B2 (ja)
AU476873B1 (ja)
AU1891376A (ja)
AR196123Q (ja)
CH519574A4 (ja)
AU479539A (ja)
CH562074A4 (ja)
CH560903A5 (ja)
CH560577A5 (ja)
CH564278A5 (ja)