JPS5029622B2 - - Google Patents
Info
- Publication number
- JPS5029622B2 JPS5029622B2 JP46080881A JP8088171A JPS5029622B2 JP S5029622 B2 JPS5029622 B2 JP S5029622B2 JP 46080881 A JP46080881 A JP 46080881A JP 8088171 A JP8088171 A JP 8088171A JP S5029622 B2 JPS5029622 B2 JP S5029622B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46080881A JPS5029622B2 (cg-RX-API-DMAC7.html) | 1971-10-15 | 1971-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46080881A JPS5029622B2 (cg-RX-API-DMAC7.html) | 1971-10-15 | 1971-10-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4847273A JPS4847273A (cg-RX-API-DMAC7.html) | 1973-07-05 |
| JPS5029622B2 true JPS5029622B2 (cg-RX-API-DMAC7.html) | 1975-09-25 |
Family
ID=13730671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46080881A Expired JPS5029622B2 (cg-RX-API-DMAC7.html) | 1971-10-15 | 1971-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5029622B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5524414A (en) * | 1978-08-09 | 1980-02-21 | Hitachi Ltd | Electrode forming process |
| JPS57106140A (en) * | 1980-12-24 | 1982-07-01 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| JPS60224248A (ja) * | 1984-04-23 | 1985-11-08 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
| JPH0628261B2 (ja) * | 1990-04-13 | 1994-04-13 | セイコーエプソン株式会社 | 金属メッキ配線を有する半導体装置の製造方法 |
-
1971
- 1971-10-15 JP JP46080881A patent/JPS5029622B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4847273A (cg-RX-API-DMAC7.html) | 1973-07-05 |