JPS5029163A - - Google Patents
Info
- Publication number
- JPS5029163A JPS5029163A JP7991673A JP7991673A JPS5029163A JP S5029163 A JPS5029163 A JP S5029163A JP 7991673 A JP7991673 A JP 7991673A JP 7991673 A JP7991673 A JP 7991673A JP S5029163 A JPS5029163 A JP S5029163A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7991673A JPS5029163A (US20020095090A1-20020718-M00002.png) | 1973-07-17 | 1973-07-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7991673A JPS5029163A (US20020095090A1-20020718-M00002.png) | 1973-07-17 | 1973-07-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5029163A true JPS5029163A (US20020095090A1-20020718-M00002.png) | 1975-03-25 |
Family
ID=13703605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7991673A Pending JPS5029163A (US20020095090A1-20020718-M00002.png) | 1973-07-17 | 1973-07-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5029163A (US20020095090A1-20020718-M00002.png) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53762U (US20020095090A1-20020718-M00002.png) * | 1976-06-23 | 1978-01-06 | ||
JPS58192354A (ja) * | 1982-05-07 | 1983-11-09 | Hitachi Ltd | 半導体装置 |
JPH024263U (US20020095090A1-20020718-M00002.png) * | 1988-06-20 | 1990-01-11 | ||
JPH02271185A (ja) * | 1989-04-13 | 1990-11-06 | Fujitsu Ltd | バルブ機構 |
JPH03152966A (ja) * | 1989-11-09 | 1991-06-28 | Nec Corp | 半導体装置用リードフレーム |
JPH03256353A (ja) * | 1990-03-06 | 1991-11-15 | Toshiba Corp | 半導体装置 |
-
1973
- 1973-07-17 JP JP7991673A patent/JPS5029163A/ja active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53762U (US20020095090A1-20020718-M00002.png) * | 1976-06-23 | 1978-01-06 | ||
JPS5821180Y2 (ja) * | 1976-06-23 | 1983-05-04 | 株式会社東芝 | 半導体装置 |
JPS58192354A (ja) * | 1982-05-07 | 1983-11-09 | Hitachi Ltd | 半導体装置 |
JPH024263U (US20020095090A1-20020718-M00002.png) * | 1988-06-20 | 1990-01-11 | ||
JPH02271185A (ja) * | 1989-04-13 | 1990-11-06 | Fujitsu Ltd | バルブ機構 |
JPH03152966A (ja) * | 1989-11-09 | 1991-06-28 | Nec Corp | 半導体装置用リードフレーム |
JPH03256353A (ja) * | 1990-03-06 | 1991-11-15 | Toshiba Corp | 半導体装置 |