JPS502868A - - Google Patents
Info
- Publication number
- JPS502868A JPS502868A JP5076773A JP5076773A JPS502868A JP S502868 A JPS502868 A JP S502868A JP 5076773 A JP5076773 A JP 5076773A JP 5076773 A JP5076773 A JP 5076773A JP S502868 A JPS502868 A JP S502868A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5076773A JPS5147576B2 (ko) | 1973-05-09 | 1973-05-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5076773A JPS5147576B2 (ko) | 1973-05-09 | 1973-05-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS502868A true JPS502868A (ko) | 1975-01-13 |
JPS5147576B2 JPS5147576B2 (ko) | 1976-12-15 |
Family
ID=12867972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5076773A Expired JPS5147576B2 (ko) | 1973-05-09 | 1973-05-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5147576B2 (ko) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51141462U (ko) * | 1975-05-07 | 1976-11-15 | ||
JPS5229065U (ko) * | 1975-08-20 | 1977-03-01 | ||
JPS5229064U (ko) * | 1975-08-20 | 1977-03-01 | ||
JPS5267978A (en) * | 1975-12-03 | 1977-06-06 | Mitsubishi Electric Corp | Boiling-cooling type semiconductor unit |
JPS5441554U (ko) * | 1977-08-30 | 1979-03-20 | ||
JPS596068U (ja) * | 1982-06-30 | 1984-01-14 | いすゞ自動車株式会社 | 制振用鋼板材の接合装置 |
WO2015010039A1 (en) * | 2013-07-19 | 2015-01-22 | General Electric Company | Method and system for an immersion boiling heat sink |
-
1973
- 1973-05-09 JP JP5076773A patent/JPS5147576B2/ja not_active Expired
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51141462U (ko) * | 1975-05-07 | 1976-11-15 | ||
JPS5229065U (ko) * | 1975-08-20 | 1977-03-01 | ||
JPS5229064U (ko) * | 1975-08-20 | 1977-03-01 | ||
JPS5619415Y2 (ko) * | 1975-08-20 | 1981-05-08 | ||
JPS5267978A (en) * | 1975-12-03 | 1977-06-06 | Mitsubishi Electric Corp | Boiling-cooling type semiconductor unit |
JPS5441554U (ko) * | 1977-08-30 | 1979-03-20 | ||
JPS5723897Y2 (ko) * | 1977-08-30 | 1982-05-24 | ||
JPS596068U (ja) * | 1982-06-30 | 1984-01-14 | いすゞ自動車株式会社 | 制振用鋼板材の接合装置 |
JPH0224542Y2 (ko) * | 1982-06-30 | 1990-07-05 | ||
WO2015010039A1 (en) * | 2013-07-19 | 2015-01-22 | General Electric Company | Method and system for an immersion boiling heat sink |
Also Published As
Publication number | Publication date |
---|---|
JPS5147576B2 (ko) | 1976-12-15 |