US3775079A
(en)
*
|
1969-04-04 |
1973-11-27 |
Corning Glass Works |
Method for simultaneously forming rim and parison
|
US3775084A
(en)
*
|
1970-01-02 |
1973-11-27 |
Owens Illinois Inc |
Pressurizer apparatus for glass ribbon machine
|
US5162055A
(en)
*
|
1991-05-07 |
1992-11-10 |
Gte Products Corporation |
Bulb forming orifice plate for bulb making apparatus
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
US9701564B2
(en)
|
2013-01-15 |
2017-07-11 |
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|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
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|
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(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
US11556039B2
(en)
|
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Electrochromic coated glass articles and methods for laser processing the same
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
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Laser processing of slots and holes
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
US9687936B2
(en)
|
2013-12-17 |
2017-06-27 |
Corning Incorporated |
Transparent material cutting with ultrafast laser and beam optics
|
US9517963B2
(en)
|
2013-12-17 |
2016-12-13 |
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Method for rapid laser drilling of holes in glass and products made therefrom
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
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Edge chamfering methods
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
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Processing 3D shaped transparent brittle substrate
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
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Laser processing of sapphire substrate and related applications
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
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Laser cutting of display glass compositions
|
EP3166895B1
(en)
|
2014-07-08 |
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Methods and apparatuses for laser processing materials
|
JP6788571B2
(ja)
|
2014-07-14 |
2020-11-25 |
コーニング インコーポレイテッド |
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|
US9617180B2
(en)
|
2014-07-14 |
2017-04-11 |
Corning Incorporated |
Methods and apparatuses for fabricating glass articles
|
WO2016010949A1
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Method and system for forming perforations
|
EP3552753A3
(en)
*
|
2014-07-14 |
2019-12-11 |
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System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
|
US10335902B2
(en)
|
2014-07-14 |
2019-07-02 |
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|
US10047001B2
(en)
|
2014-12-04 |
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|
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(en)
|
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|
US11773004B2
(en)
|
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|
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(ja)
|
2015-03-27 |
2018-06-21 |
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|
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(en)
|
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|
WO2017192835A1
(en)
|
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|
US10410883B2
(en)
|
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|
US10794679B2
(en)
|
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|
CN109803934A
(zh)
|
2016-07-29 |
2019-05-24 |
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|
WO2018044843A1
(en)
|
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|
US10730783B2
(en)
|
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|
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(en)
|
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|
US10752534B2
(en)
|
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|
US10688599B2
(en)
|
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|
US10580725B2
(en)
|
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|
US11078112B2
(en)
|
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|
US10626040B2
(en)
|
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|
US11554984B2
(en)
|
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|