JPS5025194A - - Google Patents
Info
- Publication number
- JPS5025194A JPS5025194A JP854673A JP854673A JPS5025194A JP S5025194 A JPS5025194 A JP S5025194A JP 854673 A JP854673 A JP 854673A JP 854673 A JP854673 A JP 854673A JP S5025194 A JPS5025194 A JP S5025194A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP854673A JPS5025194A (xx) | 1973-01-22 | 1973-01-22 | |
| GB243374A GB1455195A (en) | 1972-12-28 | 1974-01-18 | Light-emitting display device and a method of manufacturing the same |
| DE2402717A DE2402717A1 (de) | 1973-01-22 | 1974-01-21 | Lichtemittierende anzeigevorrichtung und verfahren zu ihrer herstellung |
| US435213A US3911431A (en) | 1973-01-22 | 1974-01-21 | Light-emitting display device |
| CA190,907A CA1006955A (en) | 1973-01-22 | 1974-01-22 | Light-emitting display device and a method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP854673A JPS5025194A (xx) | 1973-01-22 | 1973-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5025194A true JPS5025194A (xx) | 1975-03-17 |
Family
ID=11696123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP854673A Pending JPS5025194A (xx) | 1972-12-28 | 1973-01-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5025194A (xx) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5894997A (ja) * | 1981-11-25 | 1983-06-06 | マツク・エンジニアリング・アンド・イクウイプメント・カンパニ−・インコ−ポレ−テツド | バツテリプレ−ト切断装置 |
| JPS6111236A (ja) * | 1984-06-27 | 1986-01-18 | 株式会社 西部技研 | 可撓性シ−トに間欠的に波形模様またはエンボス模様をつける方法 |
| JPH04162783A (ja) * | 1990-10-26 | 1992-06-08 | Hamamatsu Photonics Kk | 発光素子 |
| JPH06112534A (ja) * | 1991-12-09 | 1994-04-22 | Rohm Co Ltd | 発光ダイオード |
-
1973
- 1973-01-22 JP JP854673A patent/JPS5025194A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5894997A (ja) * | 1981-11-25 | 1983-06-06 | マツク・エンジニアリング・アンド・イクウイプメント・カンパニ−・インコ−ポレ−テツド | バツテリプレ−ト切断装置 |
| JPS6111236A (ja) * | 1984-06-27 | 1986-01-18 | 株式会社 西部技研 | 可撓性シ−トに間欠的に波形模様またはエンボス模様をつける方法 |
| JPH04162783A (ja) * | 1990-10-26 | 1992-06-08 | Hamamatsu Photonics Kk | 発光素子 |
| JPH06112534A (ja) * | 1991-12-09 | 1994-04-22 | Rohm Co Ltd | 発光ダイオード |