JPS5023478A - - Google Patents
Info
- Publication number
- JPS5023478A JPS5023478A JP48075062A JP7506273A JPS5023478A JP S5023478 A JPS5023478 A JP S5023478A JP 48075062 A JP48075062 A JP 48075062A JP 7506273 A JP7506273 A JP 7506273A JP S5023478 A JPS5023478 A JP S5023478A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48075062A JPS5023478A (OSRAM) | 1973-07-02 | 1973-07-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48075062A JPS5023478A (OSRAM) | 1973-07-02 | 1973-07-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5023478A true JPS5023478A (OSRAM) | 1975-03-13 |
Family
ID=13565330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP48075062A Pending JPS5023478A (OSRAM) | 1973-07-02 | 1973-07-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5023478A (OSRAM) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54132675A (en) * | 1978-04-05 | 1979-10-15 | Asahi Chem Ind Co Ltd | Overlaying method |
JPS59104907A (ja) * | 1982-12-08 | 1984-06-18 | Toppan Printing Co Ltd | 密着成形装置および密着成形方法 |
JP2009018548A (ja) * | 2007-07-13 | 2009-01-29 | Fujitsu Ltd | 筐体被覆方法および電子機器筐体 |
-
1973
- 1973-07-02 JP JP48075062A patent/JPS5023478A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54132675A (en) * | 1978-04-05 | 1979-10-15 | Asahi Chem Ind Co Ltd | Overlaying method |
JPS59104907A (ja) * | 1982-12-08 | 1984-06-18 | Toppan Printing Co Ltd | 密着成形装置および密着成形方法 |
JP2009018548A (ja) * | 2007-07-13 | 2009-01-29 | Fujitsu Ltd | 筐体被覆方法および電子機器筐体 |