JPS5023093U - - Google Patents
Info
- Publication number
- JPS5023093U JPS5023093U JP7572073U JP7572073U JPS5023093U JP S5023093 U JPS5023093 U JP S5023093U JP 7572073 U JP7572073 U JP 7572073U JP 7572073 U JP7572073 U JP 7572073U JP S5023093 U JPS5023093 U JP S5023093U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Infusion, Injection, And Reservoir Apparatuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7572073U JPS5023093U (ja) | 1973-06-26 | 1973-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7572073U JPS5023093U (ja) | 1973-06-26 | 1973-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5023093U true JPS5023093U (ja) | 1975-03-14 |
Family
ID=28249085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7572073U Pending JPS5023093U (ja) | 1973-06-26 | 1973-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5023093U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5458870A (en) * | 1977-10-18 | 1979-05-11 | Omron Tateisi Electronics Co | Method of molding mold of electronic device |
| JPS54125467A (en) * | 1978-03-23 | 1979-09-28 | Omron Tateisi Electronics Co | Mold forming method of electronic appliance |
-
1973
- 1973-06-26 JP JP7572073U patent/JPS5023093U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5458870A (en) * | 1977-10-18 | 1979-05-11 | Omron Tateisi Electronics Co | Method of molding mold of electronic device |
| JPS54125467A (en) * | 1978-03-23 | 1979-09-28 | Omron Tateisi Electronics Co | Mold forming method of electronic appliance |