JPS5021485B2 - - Google Patents

Info

Publication number
JPS5021485B2
JPS5021485B2 JP46092997A JP9299771A JPS5021485B2 JP S5021485 B2 JPS5021485 B2 JP S5021485B2 JP 46092997 A JP46092997 A JP 46092997A JP 9299771 A JP9299771 A JP 9299771A JP S5021485 B2 JPS5021485 B2 JP S5021485B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP46092997A
Other versions
JPS4856709A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46092997A priority Critical patent/JPS5021485B2/ja
Priority to US307147A priority patent/US3889041A/en
Priority to DE19722257055 priority patent/DE2257055C3/de
Priority to GB5385972A priority patent/GB1408190A/en
Publication of JPS4856709A publication Critical patent/JPS4856709A/ja
Priority to US561477A priority patent/US3927815A/en
Publication of JPS5021485B2 publication Critical patent/JPS5021485B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y10S428/924—Composite
    • Y10S428/926—Thickness of individual layer specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y10T428/1284—W-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP46092997A 1971-11-22 1971-11-22 Expired JPS5021485B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP46092997A JPS5021485B2 (ja) 1971-11-22 1971-11-22
US307147A US3889041A (en) 1971-11-22 1972-11-16 Multilayer metallized beryllia ceramics and a method for producing the same
DE19722257055 DE2257055C3 (de) 1971-11-22 1972-11-21 Metallisierte mehrschichtige Berylliumoxid-Keramlk und Verfahren zu ihrer Herstellung
GB5385972A GB1408190A (en) 1971-11-22 1972-11-22 Multilayer metallized beryllia ceramics
US561477A US3927815A (en) 1971-11-22 1975-03-24 Method for producing multilayer metallized beryllia ceramics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46092997A JPS5021485B2 (ja) 1971-11-22 1971-11-22

Publications (2)

Publication Number Publication Date
JPS4856709A JPS4856709A (ja) 1973-08-09
JPS5021485B2 true JPS5021485B2 (ja) 1975-07-23

Family

ID=14069989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46092997A Expired JPS5021485B2 (ja) 1971-11-22 1971-11-22

Country Status (3)

Country Link
US (1) US3889041A (ja)
JP (1) JPS5021485B2 (ja)
GB (1) GB1408190A (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS606910B2 (ja) * 1981-12-09 1985-02-21 日本碍子株式会社 金属セラミツクス接合体
EP0691175B1 (en) 1994-06-09 2001-08-29 Honda Giken Kogyo Kabushiki Kaisha Article made by joining two members together, and a brazing filler metal
US6315188B1 (en) * 2000-06-28 2001-11-13 Sandia Corporation Surface preparation for high purity alumina ceramics enabling direct brazing in hydrogen atmospheres
CN107904575B (zh) * 2017-12-13 2020-06-09 宜宾红星电子有限公司 氧化铍基衰减瓷金属化方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2982014A (en) * 1955-05-20 1961-05-02 Meyer-Hartwig Eberhard Process of manufacturing ceramic compounds and metallic ceramic compounds
US3057445A (en) * 1958-05-23 1962-10-09 Philips Corp Metal-to-ceramic seal and method of making same
US3051592A (en) * 1958-09-29 1962-08-28 Penta Lab Inc Ceramic metalizing process
US3074143A (en) * 1960-02-01 1963-01-22 Baynard R Smith Method of making metalized ceramic bodies
US3296017A (en) * 1963-07-17 1967-01-03 North American Aviation Inc Method of chemically bonding a metal to a ceramic
US3556843A (en) * 1968-05-23 1971-01-19 Coors Porcelain Co Metallized ceramic and method and composition therefor
US3565684A (en) * 1968-05-23 1971-02-23 Coors Porcelain Co Metallized ceramic and method and composition therefor
US3620799A (en) * 1968-12-26 1971-11-16 Rca Corp Method for metallizing a ceramic body
US3661595A (en) * 1970-02-16 1972-05-09 Coors Porcelain Co Composition for metalizing ceramic

Also Published As

Publication number Publication date
US3889041A (en) 1975-06-10
GB1408190A (en) 1975-10-01
JPS4856709A (ja) 1973-08-09
DE2257055A1 (de) 1973-05-30
DE2257055B2 (de) 1976-01-08

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