JPS5021309B1 - - Google Patents
Info
- Publication number
- JPS5021309B1 JPS5021309B1 JP7167579A JP6757971A JPS5021309B1 JP S5021309 B1 JPS5021309 B1 JP S5021309B1 JP 7167579 A JP7167579 A JP 7167579A JP 6757971 A JP6757971 A JP 6757971A JP S5021309 B1 JPS5021309 B1 JP S5021309B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8361370A | 1970-10-23 | 1970-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5021309B1 true JPS5021309B1 (Direct) | 1975-07-22 |
Family
ID=22179515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7167579A Pending JPS5021309B1 (Direct) | 1970-10-23 | 1971-09-03 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3734791A (Direct) |
| JP (1) | JPS5021309B1 (Direct) |
| CA (1) | CA961744A (Direct) |
| DE (1) | DE2152143A1 (Direct) |
| FR (1) | FR2109689A5 (Direct) |
| GB (1) | GB1322676A (Direct) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5548975U (Direct) * | 1978-09-29 | 1980-03-31 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4022371A (en) * | 1976-06-14 | 1977-05-10 | International Business Machines Corporation | Vapor bonding method |
| GB1577519A (en) * | 1976-11-25 | 1980-10-22 | Multicore Solders Ltd | Soft soldering |
| US4113524A (en) * | 1977-02-24 | 1978-09-12 | Rca Corporation | Method of assembling components on printed circuit boards |
| US4168996A (en) * | 1977-05-16 | 1979-09-25 | Western Electric Company, Inc. | Soldering flux |
| US4194931A (en) * | 1977-05-16 | 1980-03-25 | Western Electric Co. | Soldering flux |
| US4238528A (en) * | 1978-06-26 | 1980-12-09 | International Business Machines Corporation | Polyimide coating process and material |
| US4273593A (en) * | 1979-06-25 | 1981-06-16 | Scm Corporation | Metal-joining paste and vehicle therefor |
| US4290824A (en) * | 1979-12-10 | 1981-09-22 | Cobar Resources, Inc. | Water soluble rosin flux |
| US4350602A (en) * | 1980-10-20 | 1982-09-21 | Harold Schiller | Fusing fluid for solder-plated circuit boards |
| US4342607A (en) * | 1981-01-05 | 1982-08-03 | Western Electric Company, Inc. | Solder flux |
| US4809901A (en) * | 1981-10-05 | 1989-03-07 | Raychem Corporation | Soldering methods and devices |
| US4563224A (en) * | 1981-10-05 | 1986-01-07 | Raychem Corporation | Soldering flux containing a temperature sensitive chemically reactive colorant |
| JPS62282773A (ja) * | 1986-05-30 | 1987-12-08 | Apollo Seiko Kk | 自動半田付け方法及び装置 |
| EP0398871B1 (de) * | 1988-01-12 | 1992-09-23 | KERNER, Rudolf A. | Verfahren zur herstellung von elektronischen komponenten unter verwendung eines weichlötflussmittels auf carbonsäurebasis |
| US4872928A (en) * | 1988-06-07 | 1989-10-10 | Johnson Matthey Inc. | Solder paste |
| US4940498A (en) * | 1989-08-14 | 1990-07-10 | Multicore Solders Limited | Flux composition |
| US4995921A (en) * | 1990-05-11 | 1991-02-26 | Motorola, Inc. | Solder pastes using alcohol blends as rheological aids |
| US5452840A (en) * | 1990-05-15 | 1995-09-26 | Hughes Aircraft Company | Water-soluble soldering flux |
| US5092943A (en) * | 1990-09-17 | 1992-03-03 | Motorola, Inc. | Method of cleaning printed circuit boards using water |
| KR100254927B1 (ko) * | 1994-12-07 | 2000-05-01 | 오까베 히로시 | 납땜용 플럭스, 땜납 페이스트 및 이것을 사용한 납땜 방법 |
| US6524398B2 (en) * | 2000-04-13 | 2003-02-25 | Fry's Metals, Inc. | Low-residue, low-solder-ball flux |
-
1970
- 1970-10-23 US US00083613A patent/US3734791A/en not_active Expired - Lifetime
-
1971
- 1971-07-27 GB GB3506171A patent/GB1322676A/en not_active Expired
- 1971-07-30 FR FR7129461A patent/FR2109689A5/fr not_active Expired
- 1971-09-03 JP JP7167579A patent/JPS5021309B1/ja active Pending
- 1971-10-18 CA CA125,323A patent/CA961744A/en not_active Expired
- 1971-10-20 DE DE19712152143 patent/DE2152143A1/de active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5548975U (Direct) * | 1978-09-29 | 1980-03-31 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1322676A (en) | 1973-07-11 |
| CA961744A (en) | 1975-01-28 |
| FR2109689A5 (Direct) | 1972-05-26 |
| US3734791A (en) | 1973-05-22 |
| DE2152143A1 (de) | 1972-04-27 |