JPS502059B1 - - Google Patents

Info

Publication number
JPS502059B1
JPS502059B1 JP2096270A JP2096270A JPS502059B1 JP S502059 B1 JPS502059 B1 JP S502059B1 JP 2096270 A JP2096270 A JP 2096270A JP 2096270 A JP2096270 A JP 2096270A JP S502059 B1 JPS502059 B1 JP S502059B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2096270A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS502059B1 publication Critical patent/JPS502059B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
JP2096270A 1969-04-02 1970-03-13 Pending JPS502059B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81270069A 1969-04-02 1969-04-02

Publications (1)

Publication Number Publication Date
JPS502059B1 true JPS502059B1 (en) 1975-01-23

Family

ID=25210373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2096270A Pending JPS502059B1 (en) 1969-04-02 1970-03-13

Country Status (4)

Country Link
JP (1) JPS502059B1 (en)
DE (1) DE2015643A1 (en)
FR (1) FR2042059A5 (en)
GB (1) GB1262245A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5398650U (en) * 1977-01-14 1978-08-10
JPS543202U (en) * 1977-06-08 1979-01-10
JPS6224739U (en) * 1985-07-30 1987-02-14
JPH01268504A (en) * 1988-04-21 1989-10-26 Cleanup Corp Cabinet for various purpose
WO1997016056A1 (en) * 1995-10-23 1997-05-01 Ibiden Co., Ltd. Resin filler and multilayer printed wiring board
WO2000025355A1 (en) * 1998-10-26 2000-05-04 Hitachi, Ltd. Method for fabricating semiconductor device
JP2016111303A (en) * 2014-12-10 2016-06-20 凸版印刷株式会社 Wiring board, semiconductor device and semiconductor device manufacturing method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3315615A1 (en) * 1983-04-29 1984-10-31 Brown, Boveri & Cie Ag, 6800 Mannheim METHOD FOR PRODUCING A MULTILAYER CIRCUIT
US4705606A (en) * 1985-01-31 1987-11-10 Gould Inc. Thin-film electrical connections for integrated circuits
US4996584A (en) * 1985-01-31 1991-02-26 Gould, Inc. Thin-film electrical connections for integrated circuits
DE3735959A1 (en) * 1987-10-23 1989-05-03 Bbc Brown Boveri & Cie Multilayer thin-film circuit and a method for its production

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5398650U (en) * 1977-01-14 1978-08-10
JPS543202U (en) * 1977-06-08 1979-01-10
JPS6224739U (en) * 1985-07-30 1987-02-14
JPH01268504A (en) * 1988-04-21 1989-10-26 Cleanup Corp Cabinet for various purpose
WO1997016056A1 (en) * 1995-10-23 1997-05-01 Ibiden Co., Ltd. Resin filler and multilayer printed wiring board
WO2000025355A1 (en) * 1998-10-26 2000-05-04 Hitachi, Ltd. Method for fabricating semiconductor device
JP2016111303A (en) * 2014-12-10 2016-06-20 凸版印刷株式会社 Wiring board, semiconductor device and semiconductor device manufacturing method

Also Published As

Publication number Publication date
FR2042059A5 (en) 1971-02-05
DE2015643A1 (en) 1970-11-05
GB1262245A (en) 1972-02-02

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