JPS502045A - - Google Patents
Info
- Publication number
- JPS502045A JPS502045A JP48050766A JP5076673A JPS502045A JP S502045 A JPS502045 A JP S502045A JP 48050766 A JP48050766 A JP 48050766A JP 5076673 A JP5076673 A JP 5076673A JP S502045 A JPS502045 A JP S502045A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48050766A JPS5137175B2 (ja) | 1973-05-09 | 1973-05-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48050766A JPS5137175B2 (ja) | 1973-05-09 | 1973-05-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS502045A true JPS502045A (ja) | 1975-01-10 |
| JPS5137175B2 JPS5137175B2 (ja) | 1976-10-14 |
Family
ID=12867947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48050766A Expired JPS5137175B2 (ja) | 1973-05-09 | 1973-05-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5137175B2 (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5085261U (ja) * | 1973-12-05 | 1975-07-21 | ||
| JPS5645058A (en) * | 1979-09-21 | 1981-04-24 | Hitachi Ltd | Resin sealing semiconductor device |
| JPS57122549A (en) * | 1980-11-08 | 1982-07-30 | Plessey Overseas | Plastic sealed electronic equipment |
| JPS60141776A (ja) * | 1983-12-29 | 1985-07-26 | Toshiba Ceramics Co Ltd | Ｉｃプラスチツクパツケ−ジ用充填材 |
| JPS63120725A (ja) * | 1986-11-11 | 1988-05-25 | Sumitomo Bakelite Co Ltd | 高熱伝導性エポキシ樹脂成形材料 |
-
1973
- 1973-05-09 JP JP48050766A patent/JPS5137175B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5085261U (ja) * | 1973-12-05 | 1975-07-21 | ||
| JPS5645058A (en) * | 1979-09-21 | 1981-04-24 | Hitachi Ltd | Resin sealing semiconductor device |
| JPS57122549A (en) * | 1980-11-08 | 1982-07-30 | Plessey Overseas | Plastic sealed electronic equipment |
| JPS60141776A (ja) * | 1983-12-29 | 1985-07-26 | Toshiba Ceramics Co Ltd | Ｉｃプラスチツクパツケ−ジ用充填材 |
| JPS63120725A (ja) * | 1986-11-11 | 1988-05-25 | Sumitomo Bakelite Co Ltd | 高熱伝導性エポキシ樹脂成形材料 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5137175B2 (ja) | 1976-10-14 |