JPS5019361A - - Google Patents

Info

Publication number
JPS5019361A
JPS5019361A JP48070343A JP7034373A JPS5019361A JP S5019361 A JPS5019361 A JP S5019361A JP 48070343 A JP48070343 A JP 48070343A JP 7034373 A JP7034373 A JP 7034373A JP S5019361 A JPS5019361 A JP S5019361A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48070343A
Other languages
Japanese (ja)
Other versions
JPS5149192B2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48070343A priority Critical patent/JPS5149192B2/ja
Publication of JPS5019361A publication Critical patent/JPS5019361A/ja
Publication of JPS5149192B2 publication Critical patent/JPS5149192B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Hall/Mr Elements (AREA)
JP48070343A 1973-06-20 1973-06-20 Expired JPS5149192B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48070343A JPS5149192B2 (enrdf_load_stackoverflow) 1973-06-20 1973-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48070343A JPS5149192B2 (enrdf_load_stackoverflow) 1973-06-20 1973-06-20

Publications (2)

Publication Number Publication Date
JPS5019361A true JPS5019361A (enrdf_load_stackoverflow) 1975-02-28
JPS5149192B2 JPS5149192B2 (enrdf_load_stackoverflow) 1976-12-24

Family

ID=13428661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48070343A Expired JPS5149192B2 (enrdf_load_stackoverflow) 1973-06-20 1973-06-20

Country Status (1)

Country Link
JP (1) JPS5149192B2 (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54148405A (en) * 1978-05-15 1979-11-20 Nippon Telegr & Teleph Corp <Ntt> Terminal control system by exchange
JPS5566165A (en) * 1978-11-13 1980-05-19 Sankyo Birudeingu Kk Information control service system
JPS5839048U (ja) * 1981-09-08 1983-03-14 三菱電機株式会社 半導体装置
JPS60130149A (ja) * 1983-12-16 1985-07-11 Seiko Instr & Electronics Ltd Ｉｃパツケ−ジ
JPS63211638A (ja) * 1988-01-08 1988-09-02 Nec Home Electronics Ltd 樹脂封止型半導体装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54148405A (en) * 1978-05-15 1979-11-20 Nippon Telegr & Teleph Corp <Ntt> Terminal control system by exchange
JPS5566165A (en) * 1978-11-13 1980-05-19 Sankyo Birudeingu Kk Information control service system
JPS5839048U (ja) * 1981-09-08 1983-03-14 三菱電機株式会社 半導体装置
JPS60130149A (ja) * 1983-12-16 1985-07-11 Seiko Instr & Electronics Ltd Ｉｃパツケ−ジ
JPS63211638A (ja) * 1988-01-08 1988-09-02 Nec Home Electronics Ltd 樹脂封止型半導体装置の製造方法

Also Published As

Publication number Publication date
JPS5149192B2 (enrdf_load_stackoverflow) 1976-12-24

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