JPS5016477A - - Google Patents
Info
- Publication number
- JPS5016477A JPS5016477A JP48064816A JP6481673A JPS5016477A JP S5016477 A JPS5016477 A JP S5016477A JP 48064816 A JP48064816 A JP 48064816A JP 6481673 A JP6481673 A JP 6481673A JP S5016477 A JPS5016477 A JP S5016477A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6481673A JPS533619B2 (cg-RX-API-DMAC7.html) | 1973-06-11 | 1973-06-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6481673A JPS533619B2 (cg-RX-API-DMAC7.html) | 1973-06-11 | 1973-06-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5016477A true JPS5016477A (cg-RX-API-DMAC7.html) | 1975-02-21 |
| JPS533619B2 JPS533619B2 (cg-RX-API-DMAC7.html) | 1978-02-08 |
Family
ID=13269137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6481673A Expired JPS533619B2 (cg-RX-API-DMAC7.html) | 1973-06-11 | 1973-06-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS533619B2 (cg-RX-API-DMAC7.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5295059U (cg-RX-API-DMAC7.html) * | 1976-01-14 | 1977-07-16 | ||
| JPS54150460U (cg-RX-API-DMAC7.html) * | 1978-04-10 | 1979-10-19 | ||
| JPS568859A (en) * | 1979-01-31 | 1981-01-29 | Thermalloy Inc | Method of mounting semiconductor case and heat dissipating plate at circuit board* mounting stud bolt* and combination of same bolt and heat dissipating plate |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61201861U (cg-RX-API-DMAC7.html) * | 1985-06-07 | 1986-12-18 | ||
| JPH0375193A (ja) * | 1989-08-15 | 1991-03-29 | Sato Kikai Seisakusho:Kk | 刷本の丁合方法 |
-
1973
- 1973-06-11 JP JP6481673A patent/JPS533619B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5295059U (cg-RX-API-DMAC7.html) * | 1976-01-14 | 1977-07-16 | ||
| JPS54150460U (cg-RX-API-DMAC7.html) * | 1978-04-10 | 1979-10-19 | ||
| JPS568859A (en) * | 1979-01-31 | 1981-01-29 | Thermalloy Inc | Method of mounting semiconductor case and heat dissipating plate at circuit board* mounting stud bolt* and combination of same bolt and heat dissipating plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS533619B2 (cg-RX-API-DMAC7.html) | 1978-02-08 |