JPS50157068A - - Google Patents
Info
- Publication number
- JPS50157068A JPS50157068A JP49064091A JP6409174A JPS50157068A JP S50157068 A JPS50157068 A JP S50157068A JP 49064091 A JP49064091 A JP 49064091A JP 6409174 A JP6409174 A JP 6409174A JP S50157068 A JPS50157068 A JP S50157068A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/075—
-
- H10W72/07141—
-
- H10W72/5363—
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49064091A JPS50157068A (enExample) | 1974-06-07 | 1974-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49064091A JPS50157068A (enExample) | 1974-06-07 | 1974-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50157068A true JPS50157068A (enExample) | 1975-12-18 |
Family
ID=13248047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49064091A Pending JPS50157068A (enExample) | 1974-06-07 | 1974-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50157068A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5856430A (ja) * | 1981-09-30 | 1983-04-04 | Nec Corp | 半導体装置の製造方法 |
| JPS5944669U (ja) * | 1982-09-14 | 1984-03-24 | 富士通株式会社 | レ−ザ−ボンデイングチツプ |
| JPS6156425A (ja) * | 1984-12-10 | 1986-03-22 | Hitachi Ltd | ボンデイング装置 |
| KR20160119230A (ko) * | 2014-02-13 | 2016-10-12 | 타이코 일렉트로닉스 (상하이) 컴퍼니 리미티드 | 레이저 솔더링 시스템 |
-
1974
- 1974-06-07 JP JP49064091A patent/JPS50157068A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5856430A (ja) * | 1981-09-30 | 1983-04-04 | Nec Corp | 半導体装置の製造方法 |
| JPS5944669U (ja) * | 1982-09-14 | 1984-03-24 | 富士通株式会社 | レ−ザ−ボンデイングチツプ |
| JPS6156425A (ja) * | 1984-12-10 | 1986-03-22 | Hitachi Ltd | ボンデイング装置 |
| KR20160119230A (ko) * | 2014-02-13 | 2016-10-12 | 타이코 일렉트로닉스 (상하이) 컴퍼니 리미티드 | 레이저 솔더링 시스템 |
| JP2017506582A (ja) * | 2014-02-13 | 2017-03-09 | タイコ エレクトロニクス （シャンハイ） カンパニー リミテッド | レーザ半田付けシステム |