JPS50156366A - - Google Patents

Info

Publication number
JPS50156366A
JPS50156366A JP49062962A JP6296274A JPS50156366A JP S50156366 A JPS50156366 A JP S50156366A JP 49062962 A JP49062962 A JP 49062962A JP 6296274 A JP6296274 A JP 6296274A JP S50156366 A JPS50156366 A JP S50156366A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49062962A
Other languages
Japanese (ja)
Other versions
JPS5331713B2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6296274A priority Critical patent/JPS5331713B2/ja
Publication of JPS50156366A publication Critical patent/JPS50156366A/ja
Publication of JPS5331713B2 publication Critical patent/JPS5331713B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP6296274A 1974-06-05 1974-06-05 Expired JPS5331713B2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6296274A JPS5331713B2 (en:Method) 1974-06-05 1974-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6296274A JPS5331713B2 (en:Method) 1974-06-05 1974-06-05

Publications (2)

Publication Number Publication Date
JPS50156366A true JPS50156366A (en:Method) 1975-12-17
JPS5331713B2 JPS5331713B2 (en:Method) 1978-09-04

Family

ID=13215445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6296274A Expired JPS5331713B2 (en:Method) 1974-06-05 1974-06-05

Country Status (1)

Country Link
JP (1) JPS5331713B2 (en:Method)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54114567U (en:Method) * 1978-01-31 1979-08-11
JPS5943537A (ja) * 1982-09-02 1984-03-10 Mitsubishi Electric Corp ワイヤボンデイング装置
JPS61166033A (ja) * 1985-07-12 1986-07-26 Hitachi Ltd ペレツトボンデイング方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529975A (en) * 1975-07-08 1977-01-25 Uniroyal Ltd Method of extracting weak monomerrlike organic matter from water solution

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529975A (en) * 1975-07-08 1977-01-25 Uniroyal Ltd Method of extracting weak monomerrlike organic matter from water solution

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54114567U (en:Method) * 1978-01-31 1979-08-11
JPS5943537A (ja) * 1982-09-02 1984-03-10 Mitsubishi Electric Corp ワイヤボンデイング装置
JPS61166033A (ja) * 1985-07-12 1986-07-26 Hitachi Ltd ペレツトボンデイング方法

Also Published As

Publication number Publication date
JPS5331713B2 (en:Method) 1978-09-04

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