JPS50147668A - - Google Patents
Info
- Publication number
- JPS50147668A JPS50147668A JP49054737A JP5473774A JPS50147668A JP S50147668 A JPS50147668 A JP S50147668A JP 49054737 A JP49054737 A JP 49054737A JP 5473774 A JP5473774 A JP 5473774A JP S50147668 A JPS50147668 A JP S50147668A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49054737A JPS50147668A (ref) | 1974-05-16 | 1974-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49054737A JPS50147668A (ref) | 1974-05-16 | 1974-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50147668A true JPS50147668A (ref) | 1975-11-26 |
Family
ID=12979088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49054737A Pending JPS50147668A (ref) | 1974-05-16 | 1974-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50147668A (ref) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5691455A (en) * | 1979-12-26 | 1981-07-24 | Fujitsu Ltd | Lead frame for manufacturing of semiconductor device |
-
1974
- 1974-05-16 JP JP49054737A patent/JPS50147668A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5691455A (en) * | 1979-12-26 | 1981-07-24 | Fujitsu Ltd | Lead frame for manufacturing of semiconductor device |