JPS50143139A - - Google Patents

Info

Publication number
JPS50143139A
JPS50143139A JP5094074A JP5094074A JPS50143139A JP S50143139 A JPS50143139 A JP S50143139A JP 5094074 A JP5094074 A JP 5094074A JP 5094074 A JP5094074 A JP 5094074A JP S50143139 A JPS50143139 A JP S50143139A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5094074A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5094074A priority Critical patent/JPS50143139A/ja
Publication of JPS50143139A publication Critical patent/JPS50143139A/ja
Pending legal-status Critical Current

Links

JP5094074A 1974-05-07 1974-05-07 Pending JPS50143139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5094074A JPS50143139A (ja) 1974-05-07 1974-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5094074A JPS50143139A (ja) 1974-05-07 1974-05-07

Publications (1)

Publication Number Publication Date
JPS50143139A true JPS50143139A (ja) 1975-11-18

Family

ID=12872808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5094074A Pending JPS50143139A (ja) 1974-05-07 1974-05-07

Country Status (1)

Country Link
JP (1) JPS50143139A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012240376A (ja) * 2011-05-23 2012-12-10 Seidensha Electronics Co Ltd 熱可塑性樹脂材の融着方法、熱可塑性樹脂材を融着する溶融棒、熱可塑性樹脂材の融着装置、及び融着した熱可塑性樹脂材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4725068U (ja) * 1971-04-12 1972-11-21
JPS4944909U (ja) * 1972-07-27 1974-04-19

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4725068U (ja) * 1971-04-12 1972-11-21
JPS4944909U (ja) * 1972-07-27 1974-04-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012240376A (ja) * 2011-05-23 2012-12-10 Seidensha Electronics Co Ltd 熱可塑性樹脂材の融着方法、熱可塑性樹脂材を融着する溶融棒、熱可塑性樹脂材の融着装置、及び融着した熱可塑性樹脂材

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