JPS50140066A - - Google Patents

Info

Publication number
JPS50140066A
JPS50140066A JP4536675A JP4536675A JPS50140066A JP S50140066 A JPS50140066 A JP S50140066A JP 4536675 A JP4536675 A JP 4536675A JP 4536675 A JP4536675 A JP 4536675A JP S50140066 A JPS50140066 A JP S50140066A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4536675A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50140066A publication Critical patent/JPS50140066A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP4536675A 1974-04-16 1975-04-16 Pending JPS50140066A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1645274 1974-04-16

Publications (1)

Publication Number Publication Date
JPS50140066A true JPS50140066A (de) 1975-11-10

Family

ID=10077580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4536675A Pending JPS50140066A (de) 1974-04-16 1975-04-16

Country Status (4)

Country Link
JP (1) JPS50140066A (de)
DE (1) DE2516007A1 (de)
FR (1) FR2268434A1 (de)
IT (1) IT1035285B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57151457U (de) * 1978-02-08 1982-09-22

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU83439A1 (de) * 1980-09-25 1981-10-29 Siemens Ag Gehaeuseloses,senkrecht steckbares single-in-line-schaltungsmodul
FR2566164B1 (fr) * 1984-06-13 1991-11-29 Cem Comp Electro Mec Dispositif de refroidissement pour semi-conducteur
US4873615A (en) * 1986-10-09 1989-10-10 Amp Incorporated Semiconductor chip carrier system
DE19505180A1 (de) * 1995-02-16 1996-08-22 Telefunken Microelectron Elektronisches Steuermodul
JPH11297906A (ja) * 1998-03-23 1999-10-29 Motorola Inc 電子アセンブリおよび製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57151457U (de) * 1978-02-08 1982-09-22

Also Published As

Publication number Publication date
FR2268434A1 (en) 1975-11-14
IT1035285B (it) 1979-10-20
DE2516007A1 (de) 1975-11-06

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