JPS50137682A - - Google Patents

Info

Publication number
JPS50137682A
JPS50137682A JP50031252A JP3125275A JPS50137682A JP S50137682 A JPS50137682 A JP S50137682A JP 50031252 A JP50031252 A JP 50031252A JP 3125275 A JP3125275 A JP 3125275A JP S50137682 A JPS50137682 A JP S50137682A
Authority
JP
Japan
Prior art keywords
base member
wafer
terminal contacts
electrical
interconnection busses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50031252A
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50137682A publication Critical patent/JPS50137682A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/834—Interconnections on sidewalls of chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP50031252A 1974-04-19 1975-03-17 Pending JPS50137682A (oth)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US462463A US3908155A (en) 1974-04-19 1974-04-19 Wafer circuit package

Publications (1)

Publication Number Publication Date
JPS50137682A true JPS50137682A (oth) 1975-10-31

Family

ID=23836497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50031252A Pending JPS50137682A (oth) 1974-04-19 1975-03-17

Country Status (5)

Country Link
US (1) US3908155A (oth)
JP (1) JPS50137682A (oth)
DE (1) DE2509507A1 (oth)
FR (1) FR2268359B1 (oth)
GB (1) GB1465424A (oth)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2100064B (en) * 1981-05-29 1984-12-12 Ferranti Ltd Electrical circuit assembly
KR960012649B1 (en) * 1987-04-22 1996-09-23 Hitachi Ltd Wafer scale or full wafer memory system, package, method thereof and wafer processing method employed therein
US5191224A (en) * 1987-04-22 1993-03-02 Hitachi, Ltd. Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein
US5038201A (en) * 1988-11-08 1991-08-06 Westinghouse Electric Corp. Wafer scale integrated circuit apparatus
US5223741A (en) * 1989-09-01 1993-06-29 Tactical Fabs, Inc. Package for an integrated circuit structure
US5086692A (en) * 1990-04-12 1992-02-11 Welch Henry W Air handling system and method for an operating room
EP0849738A3 (en) * 1996-12-19 1999-04-21 Texas Instruments Incorporated Improvements in or relating to electronic systems
DE19734032C1 (de) * 1997-08-06 1998-12-17 Siemens Ag Elektronisches Steuergerät mit Kontaktstift sowie Herstellungsverfahren

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE757345A (fr) * 1969-10-17 1971-04-09 Amp Inc Boite a fusibles
US3596140A (en) * 1969-12-01 1971-07-27 Ronald A Walsh Demountable peripheral-contact electronic circuit board assembly

Also Published As

Publication number Publication date
FR2268359A1 (oth) 1975-11-14
FR2268359B1 (oth) 1977-04-15
GB1465424A (en) 1977-02-23
DE2509507A1 (de) 1975-10-30
US3908155A (en) 1975-09-23

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