JPS50135559A - - Google Patents
Info
- Publication number
- JPS50135559A JPS50135559A JP49042927A JP4292774A JPS50135559A JP S50135559 A JPS50135559 A JP S50135559A JP 49042927 A JP49042927 A JP 49042927A JP 4292774 A JP4292774 A JP 4292774A JP S50135559 A JPS50135559 A JP S50135559A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49042927A JPS50135559A (cs) | 1974-04-17 | 1974-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49042927A JPS50135559A (cs) | 1974-04-17 | 1974-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50135559A true JPS50135559A (cs) | 1975-10-27 |
Family
ID=12649643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49042927A Pending JPS50135559A (cs) | 1974-04-17 | 1974-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50135559A (cs) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5893300A (ja) * | 1981-11-30 | 1983-06-02 | 富士通株式会社 | 多層プリント板の製造方法 |
| JPS6419795A (en) * | 1987-07-14 | 1989-01-23 | Midori Mark Seisakusho Kk | Flexible printed wiring board with multilayered pattern and manufacture thereof |
| JP2003101228A (ja) * | 2001-09-27 | 2003-04-04 | Kyocera Corp | セラミック積層体の製法 |
-
1974
- 1974-04-17 JP JP49042927A patent/JPS50135559A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5893300A (ja) * | 1981-11-30 | 1983-06-02 | 富士通株式会社 | 多層プリント板の製造方法 |
| JPS6419795A (en) * | 1987-07-14 | 1989-01-23 | Midori Mark Seisakusho Kk | Flexible printed wiring board with multilayered pattern and manufacture thereof |
| JP2003101228A (ja) * | 2001-09-27 | 2003-04-04 | Kyocera Corp | セラミック積層体の製法 |