JPS50134769A - - Google Patents
Info
- Publication number
- JPS50134769A JPS50134769A JP4094974A JP4094974A JPS50134769A JP S50134769 A JPS50134769 A JP S50134769A JP 4094974 A JP4094974 A JP 4094974A JP 4094974 A JP4094974 A JP 4094974A JP S50134769 A JPS50134769 A JP S50134769A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4094974A JPS50134769A (enrdf_load_stackoverflow) | 1974-04-15 | 1974-04-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4094974A JPS50134769A (enrdf_load_stackoverflow) | 1974-04-15 | 1974-04-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS50134769A true JPS50134769A (enrdf_load_stackoverflow) | 1975-10-25 |
Family
ID=12594743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4094974A Pending JPS50134769A (enrdf_load_stackoverflow) | 1974-04-15 | 1974-04-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS50134769A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5248707U (enrdf_load_stackoverflow) * | 1975-10-03 | 1977-04-07 | ||
JPS5370870U (enrdf_load_stackoverflow) * | 1976-11-15 | 1978-06-14 | ||
JPS57201020A (en) * | 1981-06-05 | 1982-12-09 | Hitachi Ltd | Reactive sputter etching method |
WO1988007757A1 (en) * | 1987-03-31 | 1988-10-06 | Kabushiki Kaisha Toshiba | Method of determining end point of cleaning in an apparatus for manufacturing semiconductor devices |
JPH02111020A (ja) * | 1988-10-20 | 1990-04-24 | Toshiba Corp | プラズマ処理装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3664942A (en) * | 1970-12-31 | 1972-05-23 | Ibm | End point detection method and apparatus for sputter etching |
-
1974
- 1974-04-15 JP JP4094974A patent/JPS50134769A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3664942A (en) * | 1970-12-31 | 1972-05-23 | Ibm | End point detection method and apparatus for sputter etching |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5248707U (enrdf_load_stackoverflow) * | 1975-10-03 | 1977-04-07 | ||
JPS5370870U (enrdf_load_stackoverflow) * | 1976-11-15 | 1978-06-14 | ||
JPS57201020A (en) * | 1981-06-05 | 1982-12-09 | Hitachi Ltd | Reactive sputter etching method |
WO1988007757A1 (en) * | 1987-03-31 | 1988-10-06 | Kabushiki Kaisha Toshiba | Method of determining end point of cleaning in an apparatus for manufacturing semiconductor devices |
JPH02111020A (ja) * | 1988-10-20 | 1990-04-24 | Toshiba Corp | プラズマ処理装置 |