JPS50134578A - - Google Patents

Info

Publication number
JPS50134578A
JPS50134578A JP4135874A JP4135874A JPS50134578A JP S50134578 A JPS50134578 A JP S50134578A JP 4135874 A JP4135874 A JP 4135874A JP 4135874 A JP4135874 A JP 4135874A JP S50134578 A JPS50134578 A JP S50134578A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4135874A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4135874A priority Critical patent/JPS50134578A/ja
Publication of JPS50134578A publication Critical patent/JPS50134578A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP4135874A 1974-04-10 1974-04-10 Pending JPS50134578A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4135874A JPS50134578A (fr) 1974-04-10 1974-04-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4135874A JPS50134578A (fr) 1974-04-10 1974-04-10

Publications (1)

Publication Number Publication Date
JPS50134578A true JPS50134578A (fr) 1975-10-24

Family

ID=12606258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4135874A Pending JPS50134578A (fr) 1974-04-10 1974-04-10

Country Status (1)

Country Link
JP (1) JPS50134578A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853158U (ja) * 1981-10-07 1983-04-11 日本電気株式会社 半導体集積回路
JPS59180444U (ja) * 1983-05-19 1984-12-01 ティーディーケイ株式会社 部品リ−ド変形機構
JPH01132148A (ja) * 1981-07-27 1989-05-24 Texas Instr Inc <Ti> 集積回路用キャリア

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132148A (ja) * 1981-07-27 1989-05-24 Texas Instr Inc <Ti> 集積回路用キャリア
JPH0445987B2 (fr) * 1981-07-27 1992-07-28 Texas Instruments Inc
JPS5853158U (ja) * 1981-10-07 1983-04-11 日本電気株式会社 半導体集積回路
JPS59180444U (ja) * 1983-05-19 1984-12-01 ティーディーケイ株式会社 部品リ−ド変形機構
JPH021863Y2 (fr) * 1983-05-19 1990-01-17

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