JPS50134578A - - Google Patents
Info
- Publication number
- JPS50134578A JPS50134578A JP4135874A JP4135874A JPS50134578A JP S50134578 A JPS50134578 A JP S50134578A JP 4135874 A JP4135874 A JP 4135874A JP 4135874 A JP4135874 A JP 4135874A JP S50134578 A JPS50134578 A JP S50134578A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4135874A JPS50134578A (fi) | 1974-04-10 | 1974-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4135874A JPS50134578A (fi) | 1974-04-10 | 1974-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50134578A true JPS50134578A (fi) | 1975-10-24 |
Family
ID=12606258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4135874A Pending JPS50134578A (fi) | 1974-04-10 | 1974-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50134578A (fi) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853158U (ja) * | 1981-10-07 | 1983-04-11 | 日本電気株式会社 | 半導体集積回路 |
| JPS59180444U (ja) * | 1983-05-19 | 1984-12-01 | ティーディーケイ株式会社 | 部品リ−ド変形機構 |
| JPH01132148A (ja) * | 1981-07-27 | 1989-05-24 | Texas Instr Inc <Ti> | 集積回路用キャリア |
-
1974
- 1974-04-10 JP JP4135874A patent/JPS50134578A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01132148A (ja) * | 1981-07-27 | 1989-05-24 | Texas Instr Inc <Ti> | 集積回路用キャリア |
| JPH0445987B2 (fi) * | 1981-07-27 | 1992-07-28 | Texas Instruments Inc | |
| JPS5853158U (ja) * | 1981-10-07 | 1983-04-11 | 日本電気株式会社 | 半導体集積回路 |
| JPS59180444U (ja) * | 1983-05-19 | 1984-12-01 | ティーディーケイ株式会社 | 部品リ−ド変形機構 |
| JPH021863Y2 (fi) * | 1983-05-19 | 1990-01-17 |