JPS50134372A - - Google Patents
Info
- Publication number
- JPS50134372A JPS50134372A JP3999274A JP3999274A JPS50134372A JP S50134372 A JPS50134372 A JP S50134372A JP 3999274 A JP3999274 A JP 3999274A JP 3999274 A JP3999274 A JP 3999274A JP S50134372 A JPS50134372 A JP S50134372A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3999274A JPS50134372A (enExample) | 1974-04-10 | 1974-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3999274A JPS50134372A (enExample) | 1974-04-10 | 1974-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50134372A true JPS50134372A (enExample) | 1975-10-24 |
Family
ID=12568418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3999274A Pending JPS50134372A (enExample) | 1974-04-10 | 1974-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50134372A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60158735U (ja) * | 1984-03-30 | 1985-10-22 | 関西日本電気株式会社 | 半導体装置製造用樹脂封止金型 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4856066A (enExample) * | 1971-11-15 | 1973-08-07 |
-
1974
- 1974-04-10 JP JP3999274A patent/JPS50134372A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4856066A (enExample) * | 1971-11-15 | 1973-08-07 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60158735U (ja) * | 1984-03-30 | 1985-10-22 | 関西日本電気株式会社 | 半導体装置製造用樹脂封止金型 |