JPS50131473A - - Google Patents
Info
- Publication number
- JPS50131473A JPS50131473A JP3698174A JP3698174A JPS50131473A JP S50131473 A JPS50131473 A JP S50131473A JP 3698174 A JP3698174 A JP 3698174A JP 3698174 A JP3698174 A JP 3698174A JP S50131473 A JPS50131473 A JP S50131473A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49036981A JPS588152B2 (ja) | 1974-04-03 | 1974-04-03 | ダイオ−ド ト ソノセイゾウホウ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49036981A JPS588152B2 (ja) | 1974-04-03 | 1974-04-03 | ダイオ−ド ト ソノセイゾウホウ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50131473A true JPS50131473A (US07655688-20100202-C00086.png) | 1975-10-17 |
| JPS588152B2 JPS588152B2 (ja) | 1983-02-14 |
Family
ID=12484917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49036981A Expired JPS588152B2 (ja) | 1974-04-03 | 1974-04-03 | ダイオ−ド ト ソノセイゾウホウ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS588152B2 (US07655688-20100202-C00086.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6189556A (ja) * | 1984-10-08 | 1986-05-07 | Toshiba Corp | 血球分析装置 |
| WO2020066822A1 (ja) | 2018-09-25 | 2020-04-02 | 本田技研工業株式会社 | 吐出装置及びそれを用いた金型、吐出方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3632434A (en) * | 1969-01-21 | 1972-01-04 | Jerald L Hutson | Process for glass passivating silicon semiconductor junctions |
| US3669731A (en) * | 1969-06-18 | 1972-06-13 | Gen Electric | Silicon device having a lead-silicate thereon and method of forming the same |
| JPS499263A (US07655688-20100202-C00086.png) * | 1972-05-15 | 1974-01-26 |
-
1974
- 1974-04-03 JP JP49036981A patent/JPS588152B2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3632434A (en) * | 1969-01-21 | 1972-01-04 | Jerald L Hutson | Process for glass passivating silicon semiconductor junctions |
| US3669731A (en) * | 1969-06-18 | 1972-06-13 | Gen Electric | Silicon device having a lead-silicate thereon and method of forming the same |
| JPS499263A (US07655688-20100202-C00086.png) * | 1972-05-15 | 1974-01-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS588152B2 (ja) | 1983-02-14 |
