JPS50128466A - - Google Patents
Info
- Publication number
- JPS50128466A JPS50128466A JP49033564A JP3356474A JPS50128466A JP S50128466 A JPS50128466 A JP S50128466A JP 49033564 A JP49033564 A JP 49033564A JP 3356474 A JP3356474 A JP 3356474A JP S50128466 A JPS50128466 A JP S50128466A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3356474A JPS5416388B2 (https=) | 1974-03-27 | 1974-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3356474A JPS5416388B2 (https=) | 1974-03-27 | 1974-03-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50128466A true JPS50128466A (https=) | 1975-10-09 |
| JPS5416388B2 JPS5416388B2 (https=) | 1979-06-21 |
Family
ID=12390030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3356474A Expired JPS5416388B2 (https=) | 1974-03-27 | 1974-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5416388B2 (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58144849U (ja) * | 1982-03-23 | 1983-09-29 | 富士通株式会社 | 半導体装置 |
| JPS6113953U (ja) * | 1984-06-29 | 1986-01-27 | 関西日本電気株式会社 | リ−ドフレ−ム |
| JPS62119950A (ja) * | 1985-11-19 | 1987-06-01 | Nec Corp | 半導体装置用リ−ドフレ−ム |
| JPH029156A (ja) * | 1988-06-28 | 1990-01-12 | Toshiba Corp | 半導体装置の製造方法 |
| JPH02103941A (ja) * | 1988-10-13 | 1990-04-17 | Mitsubishi Electric Corp | 半導体素子の樹脂封止方法およびこれに用いる真空式樹脂封止装置と長尺リードフレーム |
-
1974
- 1974-03-27 JP JP3356474A patent/JPS5416388B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58144849U (ja) * | 1982-03-23 | 1983-09-29 | 富士通株式会社 | 半導体装置 |
| JPS6113953U (ja) * | 1984-06-29 | 1986-01-27 | 関西日本電気株式会社 | リ−ドフレ−ム |
| JPS62119950A (ja) * | 1985-11-19 | 1987-06-01 | Nec Corp | 半導体装置用リ−ドフレ−ム |
| JPH029156A (ja) * | 1988-06-28 | 1990-01-12 | Toshiba Corp | 半導体装置の製造方法 |
| JPH02103941A (ja) * | 1988-10-13 | 1990-04-17 | Mitsubishi Electric Corp | 半導体素子の樹脂封止方法およびこれに用いる真空式樹脂封止装置と長尺リードフレーム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5416388B2 (https=) | 1979-06-21 |