JPS50123277A - - Google Patents
Info
- Publication number
- JPS50123277A JPS50123277A JP49030486A JP3048674A JPS50123277A JP S50123277 A JPS50123277 A JP S50123277A JP 49030486 A JP49030486 A JP 49030486A JP 3048674 A JP3048674 A JP 3048674A JP S50123277 A JPS50123277 A JP S50123277A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Details Of Measuring And Other Instruments (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49030486A JPS5241149B2 (US20030157025A1-20030821-C00018.png) | 1974-03-16 | 1974-03-16 | |
| US05/559,393 US4036291A (en) | 1974-03-16 | 1975-03-17 | Cooling device for electric device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49030486A JPS5241149B2 (US20030157025A1-20030821-C00018.png) | 1974-03-16 | 1974-03-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50123277A true JPS50123277A (US20030157025A1-20030821-C00018.png) | 1975-09-27 |
| JPS5241149B2 JPS5241149B2 (US20030157025A1-20030821-C00018.png) | 1977-10-17 |
Family
ID=12305154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49030486A Expired JPS5241149B2 (US20030157025A1-20030821-C00018.png) | 1974-03-16 | 1974-03-16 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4036291A (US20030157025A1-20030821-C00018.png) |
| JP (1) | JPS5241149B2 (US20030157025A1-20030821-C00018.png) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5263678A (en) * | 1975-11-21 | 1977-05-26 | Toshiba Corp | Cooling device for semiconductors |
| JPS5296443U (US20030157025A1-20030821-C00018.png) * | 1976-01-19 | 1977-07-19 | ||
| JPS5299075A (en) * | 1976-02-16 | 1977-08-19 | Hitachi Ltd | Vapor cooler |
| JPS53149567U (US20030157025A1-20030821-C00018.png) * | 1977-04-30 | 1978-11-25 | ||
| JPS5426587A (en) * | 1977-07-30 | 1979-02-28 | Amada Co Ltd | Shape steel drilling device |
| US4864385A (en) * | 1987-12-29 | 1989-09-05 | Hitachi, Ltd. | Power semiconductors connected antiparallel via heatsinks |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2638909A1 (de) * | 1976-08-28 | 1978-03-02 | Semikron Gleichrichterbau | Halbleiteranordnung |
| US4203129A (en) * | 1978-07-11 | 1980-05-13 | International Business Machines Corporation | Bubble generating tunnels for cooling semiconductor devices |
| DE3307703A1 (de) * | 1983-03-04 | 1984-09-06 | BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau | Dosen-siedekuehleinrichtung fuer leistungshalbleiterelemente |
| DE3444173C2 (de) * | 1984-12-04 | 1994-05-19 | Bbc Brown Boveri & Cie | Siedekühleinrichtung für Leistungshalbleiterelemente |
| FR2592988B1 (fr) * | 1986-01-16 | 1988-03-18 | Jeumont Schneider | Dispositifs de refroidissement de semi-conducteurs |
| US4897262A (en) * | 1988-03-22 | 1990-01-30 | Playtex Jhirmack, Inc. | Non-aerosol hair spray composition |
| US4866570A (en) * | 1988-08-05 | 1989-09-12 | Ncr Corporation | Apparatus and method for cooling an electronic device |
| US5036908A (en) * | 1988-10-19 | 1991-08-06 | Gas Research Institute | High inlet artery for thermosyphons |
| US4948554A (en) * | 1989-01-06 | 1990-08-14 | General Electric Company | Natural circulating passive cooling system for nuclear reactor containment structure |
| US5168919A (en) * | 1990-06-29 | 1992-12-08 | Digital Equipment Corporation | Air cooled heat exchanger for multi-chip assemblies |
| DE4307902C1 (de) * | 1993-03-12 | 1994-06-09 | Bosch Gmbh Robert | Kühlbare Einrichtung zur Aufnahme elektrischer Baugruppen |
| US5704416A (en) * | 1993-09-10 | 1998-01-06 | Aavid Laboratories, Inc. | Two phase component cooler |
| DE4402918C2 (de) * | 1994-02-01 | 1998-03-12 | Export Contor Ausenhandelsgese | Kühlkörper mit Flüssigkeitsfüllung |
| FR2746177B1 (fr) * | 1996-03-14 | 2000-04-07 | Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant | |
| DE19758444C2 (de) * | 1997-04-04 | 1999-12-09 | Gruendl & Hoffmann | Fluidgekühlte, Rechnereinheit - gesteuerte Baugruppe zum Schalten elektrischer Leistungen |
| US5899265A (en) * | 1997-04-08 | 1999-05-04 | Sundstrand Corporation | Reflux cooler coupled with heat pipes to enhance load-sharing |
| US7556086B2 (en) * | 2001-04-06 | 2009-07-07 | University Of Maryland, College Park | Orientation-independent thermosyphon heat spreader |
| DE10258354B3 (de) * | 2002-12-12 | 2004-07-29 | Framatome Anp Gmbh | Sicherheitsbehälter einer Kernkraftanlage |
| JP2005140492A (ja) * | 2003-06-12 | 2005-06-02 | Denso Corp | 対向振動流型熱輸送装置 |
| TW577969B (en) * | 2003-07-21 | 2004-03-01 | Arro Superconducting Technolog | Vapor/liquid separated heat exchanging device |
| US7431071B2 (en) * | 2003-10-15 | 2008-10-07 | Thermal Corp. | Fluid circuit heat transfer device for plural heat sources |
| JP4573525B2 (ja) * | 2003-12-24 | 2010-11-04 | 本田技研工業株式会社 | 固体高分子電解質型燃料電池 |
| JP4394946B2 (ja) * | 2003-12-24 | 2010-01-06 | 本田技研工業株式会社 | 燃料電池車 |
| US7677052B2 (en) * | 2005-03-28 | 2010-03-16 | Intel Corporation | Systems for improved passive liquid cooling |
| US20100319884A1 (en) * | 2008-02-08 | 2010-12-23 | National University Corporation Yokohama National University | Self-excited oscillating flow heat pipe |
| EP2331846B1 (de) * | 2008-10-01 | 2013-08-14 | MAGNA STEYR Fahrzeugtechnik AG & Co KG | Entlüftungsvorrichtung für getriebe mit wasser enthaltendem schmierstoff |
| US7791884B2 (en) * | 2008-11-10 | 2010-09-07 | Rockwell Automation Technologies, Inc. | Motor drive with heat pipe air cooling |
| US8634193B2 (en) | 2011-12-05 | 2014-01-21 | Rockwell Automation Technologies, Inc. | Device and method using induction to improve natural convection cooling |
| US10113808B2 (en) * | 2013-06-26 | 2018-10-30 | Tai-Her Yang | Heat-dissipating structure having suspended external tube and internally recycling heat transfer fluid and application apparatus |
| US20150000882A1 (en) * | 2013-06-26 | 2015-01-01 | Tai-Her Yang | Heat-Dissipating Structure Having Suspended External Tube And Internally Recycling Heat Transfer Fluid And Application Apparatus |
| US10281218B2 (en) * | 2013-06-26 | 2019-05-07 | Tai-Her Yang | Heat-dissipating structure having suspended external tube and internally recycling heat transfer fluid and application apparatus |
| US20160201992A1 (en) | 2015-01-09 | 2016-07-14 | Delta Electronics, Inc. | Heat pipe |
| JP6862304B2 (ja) * | 2017-07-06 | 2021-04-21 | 株式会社東芝 | ヒートパイプ |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3609991A (en) * | 1969-10-13 | 1971-10-05 | Ibm | Cooling system having thermally induced circulation |
| US3633665A (en) * | 1970-05-11 | 1972-01-11 | Atomic Energy Commission | Heat exchanger using thermal convection tubes |
| US3741292A (en) * | 1971-06-30 | 1973-06-26 | Ibm | Liquid encapsulated air cooled module |
-
1974
- 1974-03-16 JP JP49030486A patent/JPS5241149B2/ja not_active Expired
-
1975
- 1975-03-17 US US05/559,393 patent/US4036291A/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5263678A (en) * | 1975-11-21 | 1977-05-26 | Toshiba Corp | Cooling device for semiconductors |
| JPS5856978B2 (ja) * | 1975-11-21 | 1983-12-17 | 株式会社東芝 | ハンドウタイノ レイキヤクソウチ |
| JPS5296443U (US20030157025A1-20030821-C00018.png) * | 1976-01-19 | 1977-07-19 | ||
| JPS5722446Y2 (US20030157025A1-20030821-C00018.png) * | 1976-01-19 | 1982-05-15 | ||
| JPS5299075A (en) * | 1976-02-16 | 1977-08-19 | Hitachi Ltd | Vapor cooler |
| JPS53149567U (US20030157025A1-20030821-C00018.png) * | 1977-04-30 | 1978-11-25 | ||
| JPS5426587A (en) * | 1977-07-30 | 1979-02-28 | Amada Co Ltd | Shape steel drilling device |
| JPS5634366B2 (US20030157025A1-20030821-C00018.png) * | 1977-07-30 | 1981-08-10 | ||
| US4864385A (en) * | 1987-12-29 | 1989-09-05 | Hitachi, Ltd. | Power semiconductors connected antiparallel via heatsinks |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5241149B2 (US20030157025A1-20030821-C00018.png) | 1977-10-17 |
| US4036291A (en) | 1977-07-19 |
